Printed circuit board having embedded dies and method of forming same

Abstract

A package includes a printed circuit board (PCB) having a first side and a second side and a thickness between the first side and the second side and a stacked die including a top die mounted on a bottom die, the bottom die being at least partially embedded in the PCB. Also a method of forming a package that includes forming an opening in a top surface of the PCB layer, placing a stacked die including a top die stacked on a bottom die into the opening, laminating the PCB layer to form a laminate layer, and forming an electrical connection with the stacked die.

1 . A package comprising:
 a printed circuit board (PCB) having a first side and a second side and a thickness between the first side and the second side; and   a stacked die comprising a top die mounted on a bottom die, the bottom die being at least partially embedded in the PCB.   
     
     
         2 . The package of  claim 1  wherein the bottom die is completely embedded in the PCB. 
     
     
         3 . The package of  claim 1  wherein the stacked die is completely embedded in the PCB. 
     
     
         4 . The package of  claim 1  wherein at least part of the bottom die projects beyond a top surface of the PCB. 
     
     
         5 . The package of  claim 1  including at least one trace on the PCB first side electrically coupled to the stacked die. 
     
     
         6 . The package of  claim 1  wherein said stacked die comprises an active die. 
     
     
         7 . The package of  claim 1  wherein said top die comprises an analog die. 
     
     
         8 . The package of  claim 1  wherein the PCB includes an internal conductive layer and an electrical coupling between the stacked die and the internal conductive layer. 
     
     
         9 . The package of  claim 8  including a laminate layer on the PCB and at least one via in the laminate layer coupling the stacked die to a trace on a surface of the laminate layer. 
     
     
         10 . The package of  claim 1  including a laminate layer on the PCB. 
     
     
         11 . The package of  claim 10  including at least one via in the laminate layer coupling the stacked die to a trace on a surface of the laminate layer. 
     
     
         12 . The package of  claim 1  further including a device, selected from the group consisting of a set top box, music player, video player, entertainment unit, navigation device, communications device, personal digital assistant (PDA), fixed location data unit, and a computer, into which the package is integrated. 
     
     
         13 . A system comprising:
 a printed circuit board (PCB) means having a top surface;   an opening means formed on the top surface;   a stacked die means comprising a top die means and a bottom die means, the stacked die means formed in the opening means;   laminating means for laminating the PCB means; and   means for forming an electrical connection with the stacked die means.   
     
     
         14 . The system of  claim 13 , wherein at least a portion of the top die means projects beyond a top surface of the laminating means. 
     
     
         15 . The system of  claim 13  wherein no part of the top die means projects beyond a top surface of the laminating means. 
     
     
         16 . The system of  claim 13  at least part of the bottom die means projects beyond a top surface of the laminating means. 
     
     
         17 . The system of  claim 13  wherein the opening means comprises a through opening means in the PCB means and a tape means placed on a bottom side of the PCB means over an end of the through opening means. 
     
     
         18 . The system of  claim 13  wherein the means for forming an electrical connection with the stacked die means comprises a via through the laminating means, the via connected to a trace on a top surface of the laminating means. 
     
     
         19 . The system of  claim 13  wherein the means for forming an electrical connection with the stacked die means comprises means for electrically connecting the stacked die means to an internal conductive layer of the PCB means.