US2013267808A1PendingUtilityA1

Transcutaneous analyte sensor

Assignee: DEXCOM INCPriority: Jul 13, 2004Filed: May 28, 2013Published: Oct 10, 2013
Est. expiryJul 13, 2024(expired)· nominal 20-yr term from priority
A61B 5/6833A61B 5/14532A61B 5/150022A61B 5/743A61B 5/14865A61B 5/1495A61B 2560/0252A61B 5/6849A61B 2560/0223A61B 5/14546A61B 5/1451A61B 5/1486A61M 5/158A61B 5/0002A61B 5/6848A61B 5/145A61B 5/1411
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Claims

Abstract

The present invention relates generally to systems and methods for measuring an analyte in a host. More particularly, the present invention relates to systems and methods for transcutaneous measurement of glucose in a host.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A system for measuring an analyte in a host, comprising:
 an on-skin assembly comprising:
 an electronics unit; 
 a mounting unit releasably matable to the electronics unit; and 
 a sensor comprising:
 an in vivo portion adapted for insertion through an exit port of the mounting unit and through an exit site of the host's skin; and 
 an ex vivo portion adapted to remain above the host's skin after insertion of the in vivo portion and to operably connect to the electronics unit, 
 
   wherein the electronics unit, when releasably mated to the mounting unit, together comprise a subassembly that has a volume of less about 8 cm 3  and a thickness of less than about 10 mm, whereby motion artifacts cased by motion of the subassembly translating to the sensor in vivo is reduced as compared to a subassembly that has a volume of greater than about 8 cm 3  and a thickness of greater than about 10 mm.   
     
     
         2 . The system of  claim 1 , wherein the electronics unit, when releasably mated to the mounting unit, together comprise a subassembly that has a volume of less about 6 cm 3  and a thickness of less than about 9 mm, whereby motion artifacts caused by motion of the subassembly translating to the sensor in vivo is reduced as compared to a subassembly that has a volume of greater than about 6 cm 3  and a thickness of greater than about 9 mm. 
     
     
         3 . The system of  claim 1 , wherein the electronics unit and housing each comprise a mutually engaging electrical contact. 
     
     
         4 . The system of  claim 1 , wherein the mounting unit comprises an elastomeric sealing member for sealing the operable connection of the sensor with the electronics unit. 
     
     
         5 . The system of  claim 1 , wherein the sensor exits the mounting unit at an edge or near an edge of the device. 
     
     
         6 . The system of  claim 1 , wherein the electronics unit is configured to slide-fit into the mounting unit. 
     
     
         7 . The system of  claim 1 , wherein the applicator is configured to slide-fit into the mounting unit. 
     
     
         8 . The system of  claim 1 , wherein the applicator comprises an automated spring-loaded mechanism configured to apply a continuous torque to insert the sensor. 
     
     
         9 . The system of  claim 1 , wherein the electronics unit comprises an ASIC. 
     
     
         10 . The system of  claim 9 , wherein the ASIC comprises a data sampling portion. 
     
     
         11 . The system of  claim 9 , wherein the ASIC comprises a transmitter portion. 
     
     
         12 . The system of  claim 1 , wherein the system is configured such that use of the system beyond a predetermined time period is prevented. 
     
     
         13 . The system of  claim 12 , wherein the system is configured to render the sensor inoperative after the predetermined time period. 
     
     
         14 . The system of  claim 12 , wherein the system is configured to render the sensor inoperative in response to release of the mating of the electronics unit with the mounting unit.

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