US2013259738A1PendingUtilityA1
Low Melting Temperature Solder Alloy
Est. expiryMar 30, 2032(~5.7 yrs left)· nominal 20-yr term from priority
B23K 35/0222C22C 13/02B23K 35/264
16
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Claims
Abstract
A solder composition is provided. The solder composition consists essentially of from about 6.0 to 7.5 percent by weight of bismuth, from about 0.5 to 0.7 percent by weight of copper, and the remainder of the composition being tin.
Claims
exact text as granted — not AI-modifiedWe claim:
1 . A solder composition consisting essentially of:
from about 6.0 to 7.5 percent by weight of bismuth; from about 0.5 to 0.7 percent by weight of copper; and the remainder of the composition being tin.
2 . The solder of claim 1 wherein the bismuth composition is approximately 6.5 percent.
3 . The solder composition of claim 1 wherein the bismuth composition is approximately 7 percent.
4 . The solder composition of any one of claims 1 to 3 wherein the copper composition is approximately 0.7 percent.
5 . The solder of claim 1 wherein the solder is hypoeutectic.
6 . A use of the solder composition of claim 1 for soldering metallic contacts.
7 . The use of claim 6 wherein the solder is used for soldering copper contacts.
8 . The use of claim 6 whereby the solder, when molten, partially dissolves the metallic contact.
9 . The use of claim 7 whereby the solder, when molten, partially dissolves the copper contact.
10 . The use of the solder of claim 9 whereby when the copper contact is partially dissolved, the solder is hypoeutectic.
11 . The use of the composition of claim 1 with a Tg 140° C. laminate circuit board.
12 . An electronic device comprising the solder of claim 1 .Join the waitlist — get patent alerts
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