US2013258575A1PendingUtilityA1

Formed pcb

Assignee: APPLE INCPriority: Aug 19, 2010Filed: May 30, 2013Published: Oct 3, 2013
Est. expiryAug 19, 2030(~4.1 yrs left)· nominal 20-yr term from priority
G06F 1/1626H05K 2201/056Y10T29/49155H05K 1/189H05K 1/0281G06F 1/1658H05K 7/1427G06F 1/181
52
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Claims

Abstract

Methods for forming PCBs that can be used in a portable computing device are described. The PCBs can be installed in the portable computing device in a bent configuration. In a particular embodiment, a contiguously formed PCB can be shaped with two large regions connected a thin connector portion. The thin connector portion can connect components one each of the two large regions and can be used in lieu of a flex connector. In one embodiment, the PCB can be formed from multiple layers including trace and substrate layers. The trace and substrate layer can be adjusted to affect the stiffness of the PCB in various regions, such as to allow the PCB to hold a bent configuration after a bending moment is applied.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An electronic device comprising:
 a housing, comprising:
 a first side wall having a first planar portion; and 
 a second side wall having a second planar portion that is perpendicular to the first planar portion; and 
   a contiguous multilayered printed circuit board formed within the housing, comprising:
 a first planar region that is mounted along the first planar portion of the first side wall; and 
 a second planar region that is mounted along the second planar portion of the second side wall. 
   
     
     
         2 . The electronic device defined in  claim 1 , further comprising a processor and a memory formed on the contiguous multilayered printed circuit board. 
     
     
         3 . The electronic device defined in  claim 2 , further comprising a battery installed within the housing. 
     
     
         4 . The electronic device defined in  claim 3 , wherein the battery is installed adjacent to the first and second planar regions of the contiguous multilayered printed circuit board. 
     
     
         5 . The electronic device defined in  claim 4 , further comprising device components attached to the first planar region of the contiguous multilayered printed circuit board. 
     
     
         6 . The electronic device defined in  claim 5 , wherein the contiguous multilayered printed circuit board includes a stiffening layer with conductive material that forms connections between the device components. 
     
     
         7 . The electronic device defined in  claim 6 , wherein the conductive material is configured to stiffen the contiguous multilayered printed circuit board in a bent portion of the contiguous multilayered printed circuit board that extends between the first and second planar regions of the contiguous multilayered printed circuit board. 
     
     
         8 . An electronic device comprising:
 a housing, wherein at least a portion of the housing has a curved inner surface; and   a printed circuit board formed within the housing, wherein the printed circuit board includes a portion that is bent to accommodate the curved inner surface of the housing.   
     
     
         9 . The electronic device defined in  claim 8 , further comprising an electronic component having a surface that runs along the bent portion of the printed circuit board. 
     
     
         10 . The electronic device defined in  claim 8 , wherein the printed circuit board comprises a stiffening layer. 
     
     
         11 . The electronic device defined in  claim 10 , wherein the stiffening layer comprises a shape memory alloy. 
     
     
         12 . The electronic device defined in  claim 11 , wherein the shape memory alloy holds the bent portion of the printed circuit board in a bent configuration that accommodates the curved inner surface. 
     
     
         13 . The electronic device defined in  claim 12 , wherein the shape memory alloy is a heat activated shape memory alloy. 
     
     
         14 . The electronic device defined in  claim 11 , wherein the shape memory alloy comprises Nitinol. 
     
     
         15 . The electronic device defined in  claim 8 , further comprising a battery mounted adjacent to the bent portion of the printed circuit board. 
     
     
         16 . An electronic device comprising:
 an enclosure; and   a printed circuit board, comprising:   a first region that is secured at a first height within the enclosure;   a second region that is secured at a second height within the enclosure, wherein the first height is different from the second height; and   a bent region that extends contiguously between the first region and the second region.   
     
     
         17 . The electronic device defined in  claim 16 , further comprising:
 a device component installed within the enclosure.   
     
     
         18 . The electronic device defined in  claim 17 , wherein the printed circuit board includes an additional bent region. 
     
     
         19 . The electronic device defined in  claim 18 , wherein the device component comprises a portion that is interposed between the bent region and the additional bent region of the printed circuit board. 
     
     
         20 . The electronic device defined in  claim 19 , wherein the printed circuit board is a rigid printed circuit board that is bent around the device component.

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