Surface inspection tool and surface inspection method

Abstract

A surface inspection tool 110 measures scattering light intensity of scattering light generated by irradiated irradiation light in association with a measurement coordinate on a wafer 200 with patterns and inspects the surface roughness of the wafer 200. The surface inspection tool includes a controller 250 which extracts measurement coordinate of the measured scattering light intensity that is equal to or more than a lower limit threshold L, sets an inspection range 406 of the surface roughness inspection in a partial layout 405 a of a part of the whole layout 401 of the pattern corresponding to the periphery of the extracted measurement coordinate, and obtains the surface roughness in the inspection range 406.

1 - 13 . (canceled) 
     
     
         14 . A system for acquiring scattering light distribution of an object formed on a pattern, comprising:
 an illumination unit which irradiates the object with light;   a detection unit which detects scattered light from the object; and   a processing unit which acquires a scattering light distribution image from a detection result of the detection unit.   
     
     
         15 . The system according to  claim 14 , wherein the processing unit relates the scattering light distribution image to a pattern layout. 
     
     
         16 . The system according to  claim 14 , wherein the illumination unit irradiates at least one of a memory area and a logic area with the light. 
     
     
         17 . The system according to  claim 16 , wherein the illumination unit irradiates the memory area and the logic area with the light. 
     
     
         18 . A method for acquiring scattering light distribution of an object formed on a pattern, the method comprising the steps of:
 irradiating the object with light;   detecting scattered light from the object; and   acquiring a scattering light distribution image from the detected scattered light.   
     
     
         19 . The method according to  claim 18 , further comprising the step of relating the scattering light distribution image to a pattern layout. 
     
     
         20 . The method according to  claim 18 , wherein at least one of a memory area and a logic area is irradiated with the light. 
     
     
         21 . The method according to  claim 20 , wherein the memory area and the logic area are irradiated with the light.