Memory module with heat dissipating apparatus

Abstract

A memory module includes a plurality of memory cards and a heat dissipating apparatus. The heat dissipating apparatus is a continuously-bending metal sheet. The heat dissipating apparatus includes a plurality of thermal conductive portions arranged in a row and a plurality of connecting sheets locating in between the thermal conductive portions respectively and configured to connect with the two adjacent thermal conductive portions. Each of the thermal conductive portions includes a top plate, a front side plate, and a rear side plate, the front and rear side plates extend from two opposite sides of the top plate respectively. The front and rear side plates of each of the thermal conductive portions are configured to snugly clip to one of the memory cards and are in contact with heat sources on two opposite sides of the corresponding memory card.

The invention claimed is: 
     
         1 . A heat dissipating apparatus being a continuously-bending metal sheet for dissipating heat generated from a plurality of devices, wherein two opposite sides of each of the devices have a plurality of heat sources respectively, the heat dissipating apparatus comprising:
 a plurality of thermal conductive portions arranged in a row, each of the thermal conductive portions having a top plate, a front side plate and a rear side plate, the front and the rear side plates respectively extending downwardly from two opposite ends of the top plate and incline inwardly toward each other, the rear side plate facing the front side plate of another conductive portion which is adjacent thereto; and wherein each of the thermal conductive portions has a distance between the front side plate and the rear side plate to be configured to snugly clip to one of the devices, and the front side and rear side plates of each of the thermal conductive portions are in contact with the heat sources on opposite sides of the corresponding device; and   a plurality of connecting sheets respectively located in between the thermal conductive portions, each of the connecting sheets having a front edge and a rear edge, the front edge connecting with a bottom end of the rear side plate of one of the thermal conductive portions, the rear edge connecting with a bottom end of the front side plate of another thermal conductive portion which is adjacent thereto.   
     
     
         2 . The heat dissipating apparatus of  claim 1 , wherein the front side plate and the rear side plate of each of the thermal conductive portions define a plurality of air vents thereon respectively. 
     
     
         3 . A memory module comprising:
 a plurality of memory cards, each of the memory cards having a plurality of heat sources on two opposite sides thereof respectively; and   a heat dissipating apparatus assembled to the memory cards, the heat dissipating apparatus being a continuously-bending metal sheet and including a plurality of thermal conductive portions arranged in row and a plurality of connecting sheets locating in between the thermal conductive portions respectively; wherein each of the thermal conductive portions has a top plate, a front side plate and a rear side plate, the front side plate and the rear side plate respectively extend downwardly from two opposite ends of the top plate, and the rear side plate faces the front side plate of another thermal conductive portion which is adjacent thereto; wherein each of the connecting sheets has a front edge and a rear edge, the front edge connects with a bottom end of the rear side plate of one of the thermal conductive portions, and the rear edge connects with a bottom end of the front side plate of another thermal conductive portion which is adjacent thereto; and wherein the front side plate and the rear side plate of each of the thermal conductive portions snugly clip to one of the memory cards and are in contact with the heat sources on the two opposite sides of the corresponding memory card.   
     
     
         4 . The memory module of  claim 3 , wherein the front side plate and the rear side plate of each of the thermal conductive portions of the heat dissipating apparatus define a plurality of air vents thereon respectively.