Circuit module

Abstract

A circuit module provided with an auxiliary substrate includes a structure in which electronic components are mounted on a circuit substrate arranged at a bottom, an insulating resin covering the electronic components is defined so as to be higher than the electronic components, and the auxiliary substrate is arranged on the insulating resin. As a result, there has been a problem in that the height of the circuit module is increased. The circuit module is defined such that at least one of the electronic components is in contact with the auxiliary substrate.

What is claimed is: 
     
         1 . A circuit module comprising:
 a circuit substrate;   a plurality of electronic components mounted on one main surface of the circuit substrate;   an auxiliary substrate arranged on the one main surface side of the circuit substrate on which the electronic components are mounted; and   an insulating resin arranged between the circuit substrate and the auxiliary substrate so as to cover the electronic components; wherein   the auxiliary substrate includes a base material layer having a shielding characteristic; and   the base material layer is connected to a ground electrode of the circuit substrate through an electronic component covered by the insulating resin.   
     
     
         2 . The circuit module according to  claim 1 , wherein the base material layer includes a cutout portion defined therein directly above at least one of the electronic components. 
     
     
         3 . The circuit module according to  claim 1 , wherein
 the auxiliary substrate includes an electrode pattern arranged on a circuit substrate side of the base material layer; and   at least one passive device is made of the electrode pattern.   
     
     
         4 . The circuit module according to  claim 1 , wherein
 the auxiliary substrate includes an electrode pattern arranged on a side of the base material layer opposite to a circuit substrate side of the base material layer; and   at least one passive device is defined by the electrode pattern.   
     
     
         5 . The circuit module according to  claim 1 , wherein the auxiliary substrate is in contact with a top surface of an electronic component that is the tallest among the plurality of electronic components mounted on the circuit substrate. 
     
     
         6 . The circuit module according to  claim 1 , wherein a column-shaped conductive element is arranged as the electronic component connecting the base material layer to the ground electrode of the circuit substrate. 
     
     
         7 . The circuit module according to  claim 1 , wherein the plurality of electronic components include at least one of a capacitor, a resistor, a filter, an inductor, and an integrated circuit. 
     
     
         8 . The circuit module according to  claim 1 , wherein the electronic component covered by the insulating resin includes a grounded metal case electrically connected to the ground electrode. 
     
     
         9 . The circuit module according to  claim 1 , wherein the base material layer is made of Cu or Ag and is defined by an electrode within the auxiliary substrate, which is made of a glass epoxy resin. 
     
     
         10 . The circuit module according to  claim 5 , wherein the base material layer includes a cutout portion defined therein directly above the top surface of an electronic component that is the tallest among the plurality of electronic components mounted on the circuit substrate. 
     
     
         11 . The circuit module according to  claim 10 , wherein the cutout portion includes a via hole defined in the auxiliary substrate filled with a conductive material. 
     
     
         12 . The circuit module according to  claim 11 , wherein the conductive material is a conductive paste. 
     
     
         13 . The circuit module according to  claim 3 , wherein the at least one passive device is an inductor and/or a capacitor. 
     
     
         14 . The circuit module according to  claim 4 , wherein the at least one passive device is an antenna. 
     
     
         15 . The circuit module according to  claim 2 , wherein
 the auxiliary substrate includes an electrode pattern arranged on a circuit substrate side of the base material layer; and   at least one passive device is made of the electrode pattern.   
     
     
         16 . The circuit module according to  claim 15 , wherein the at least one passive device is an inductor and/or a capacitor. 
     
     
         17 . The circuit module according to  claim 2 , wherein
 the auxiliary substrate includes an electrode pattern arranged on a side of the base material layer opposite to a circuit substrate side of the base material layer; and   at least one passive device is defined by the electrode pattern.   
     
     
         18 . The circuit module according to  claim 17 , wherein the at least one passive device is an antenna. 
     
     
         19 . The circuit module according to  claim 2 , wherein the auxiliary substrate is in contact with a top surface of an electronic component that is the tallest among the plurality of electronic components mounted on the circuit substrate. 
     
     
         20 . The circuit module according to  claim 2 , wherein a column-shaped conductive element is arranged as the electronic component connecting the base material layer to the ground electrode of the circuit substrate.