Micro-Cooling Device

Abstract

Micro-cooling device comprising:—an elongate body having a first end and an opposite second end;—an evaporation chamber arranged at the first end of the elongate body;—a feed channel arranged between a feed opening, for feeding a high pressure cooling medium, at the second end of the elongate body and the evaporation chamber;—a discharge channel arranged between the evaporation chamber and a discharge opening at the second end of the elongate body;—a restriction arranged in the feed channel and adjacent to the evaporation chamber;—temperature equalization means for equalizing the temperature over a isothermal zone extending from the first end to a first zone of the feed channel upstream of the restriction.

1 . A micro-cooling device comprising:
 an elongate body having a first end and an opposite second end;   an evaporation chamber arranged at the first end of the elongate body;   a feed channel arranged between a feed opening, for feeding a high pressure cooling medium, at the second end of the elongate body and the evaporation chamber;   a discharge channel arranged between the evaporation chamber and a discharge opening at the second end of the elongate body;   a restriction arranged in the feed channel and adjacent to the evaporation chamber, and   temperature equalization means for equalizing the temperature over an isothermal zone extending from the first end to a first zone of the feed channel upstream of the restriction.   
     
     
         2 . The micro-cooling device according to  claim 1 , wherein the temperature equalization means are embodied by the evaporation chamber comprising a chamber section extending beyond the restriction and being in heat exchanging contact with the first zone of the feed channel. 
     
     
         3 . The micro-cooling device according to  claim 1 , wherein the temperature equalization means comprises a high thermal conductive layer in heat exchanging contact with the evaporation chamber and the first zone of the feed channel. 
     
     
         4 . The micro-cooling device according to  claim 1 , comprising an attachment zone in heat exchanging contact with the evaporation chamber, for attaching an electronic component. 
     
     
         5 . The micro-cooling device according to  claim 1 , wherein filter means are arranged in the first zone of the feed channel. 
     
     
         6 . The micro-cooling device according to  claim 5 , wherein the filter means comprise a plurality of pillars projecting in the feed channel. 
     
     
         7 . The micro-cooling device according to  claim 1 , wherein at least one particle trap is arranged in the first zone of the feed channel. 
     
     
         8 . The micro-cooling device according to  claim 7 , wherein the particle trap comprises a plurality of passage openings having dimensions of the same magnitude as the restriction. 
     
     
         9 . The micro-cooling device according to  claim 1 , comprising:
 a temperature sensor arranged in heat exchanging contact with the feed channel and upstream from the first zone;   a heater arranged in heat exchanging contact with the evaporation chamber; and   control means for controlling the heater dependent on the temperature sensor measurements.   
     
     
         10 . The micro-cooling device according to  claim 1 , wherein the feed channel and discharge channel are in counter-flow heat exchanging contact. 
     
     
         11 . The micro-cooling device according to  claim 1 , wherein the device is composed out of micro-machined glass layers. 
     
     
         12 . The micro-cooling device according to  claim 1 , comprising a compressor with a low pressure inlet connected to the discharge opening and a high pressure outlet connected to the feed opening.