System and Method for Integrated Inductor

Abstract

In one embodiment, an inductor has a substrate, a conductor disposed above the substrate and a seamless ferromagnetic material surrounding at least a first portion of the conductor.

What is claimed is: 
     
         1 . A method of manufacturing a circuit, the method comprising:
 depositing a conductive line on a substrate;   removing a portion of the substrate adjacent to at least a portion of the conductive line; and   depositing a seamless magnetic material surrounding at least the portion of the conductive line.   
     
     
         2 . The method of  claim 1 , further comprising forming the substrate, wherein forming the substrate comprises depositing a dummy layer on a first substrate layer before depositing the conductive line, wherein removing the portion of the substrate adjacent to at least the portion of the conductive line comprises removing at least a portion of the dummy layer underneath at least the portion of the conductive line. 
     
     
         3 . The method of  claim 1 , wherein removing the portion of the substrate adjacent to at least the portion of the conductive line comprises etching a cavity into at least a portion of the substrate beneath at least the portion of the conductive line. 
     
     
         4 . The method of  claim 1 , wherein depositing the conductive line on the substrate comprises depositing the conductive line inside the substrate. 
     
     
         5 . The method of  claim 1 , wherein depositing the conductive line on the substrate comprises depositing the conductive line over the substrate. 
     
     
         6 . The method of  claim 1  wherein removing the portion of the substrate comprises etching the portion of the substrate through the entire substrate. 
     
     
         7 . The method of  claim 1 , further comprising forming a pad coupled to the conductive line. 
     
     
         8 . The method of  claim 1 , wherein depositing the seamless magnetic material comprises depositing a magnetic mold material. 
     
     
         9 . The method of  claim 8 , wherein depositing the magnetic mold material comprises injecting a polymer comprising magnetic particles around the conductive line. 
     
     
         10 . The method of  claim 1 , wherein the circuit comprises an inductor. 
     
     
         11 . The method of  claim 1 , wherein the depositing the seamless magnetic material comprises depositing magnetic particles. 
     
     
         12 . The method of  claim 1 , wherein removing the portion of the substrate comprises:
 etching a first portion of the substrate from a top side of the substrate; and   grinding or etching a second portion of the substrate from a back side of the substrate.   
     
     
         13 . A method of forming an inductor, the method comprising:
 providing a substrate;   forming a conductive line on the substrate;   etching a portion of the substrate adjacent to at least a portion of the conductive line; and   forming a seamless magnetic material around at least the portion of the conductive line.   
     
     
         14 . The method of  claim 13 , wherein the substrate comprises silicon. 
     
     
         15 . The method of  claim 13 , wherein forming the conductive line comprises disposing copper on the substrate. 
     
     
         16 . The method of  claim 13 , wherein forming the seamless magnetic material comprises:
 forming a mold with a mold material comprising ferrite particles, forming the mold comprising using a mold tool having a cavity that defines outside dimensions of the seamless magnetic material.   
     
     
         17 . The method of  claim 13 , wherein etching the portion of the substrate comprises etching the substrate beneath the conductive line. 
     
     
         18 . A method of forming an inductor comprising:
 providing a substrate;   forming a trench in the substrate;   forming a conductor in the trench;   forming a gap extending from a top surface of the substrate through a bottom surface of the substrate; and   forming a seamless magnetic material surrounding at least a first portion of the conductor and filling the gap.   
     
     
         19 . The method of  claim 18 , wherein forming the trench comprises forming a deep trench. 
     
     
         20 . The method of  claim 18 , wherein the gap is disposed adjacent to a first side of the first portion of the conductor.