Solid-state image pickup apparatus and electronic apparatus

Abstract

A solid-state image pickup apparatus includes a pixel region in which a plurality of pixels each including a photoelectric conversion element are arranged, transfer wirings formed on the pixel region in parallel to each other with uniform opening widths, and different wirings formed in a wiring layer above the transfer wirings. At least a part of the different wirings is overlapped with the transfer wirings on a plan position. The transfer wirings and the different wirings form a light shielding structure in the pixel region.

What is claimed is: 
     
         1 . A solid-state image pickup apparatus, comprising:
 a pixel region in which a plurality of pixels each including a photoelectric conversion element are arranged;   transfer wirings formed on the pixel region in parallel to each other with uniform opening widths; and   different wirings formed in a wiring layer above the transfer wirings, at least a part of the different wirings being overlapped with the transfer wirings on a plan position, the transfer wirings and the different wirings forming a light shielding structure in the pixel region.   
     
     
         2 . The solid-state image pickup apparatus according to  claim 1 , wherein
 the photoelectric conversion element is provided on a first surface of a substrate, and the wiring layer is provided on a second surface of the substrate.   
     
     
         3 . The solid-state image pickup apparatus according to  claim 2 , further comprising
 a second substrate bonded to the second surface side of the substrate through the wiring layer, wherein   the second substrate includes a peripheral circuit unit, and   the light shielding structure is formed between the pixel region and the peripheral circuit unit.   
     
     
         4 . The solid-state image pickup apparatus according to  claim 1 , further comprising
 an active element configured to perform signal processing and provided close to the photoelectric conversion element.   
     
     
         5 . The solid-state image pickup apparatus according to  claim 4 , wherein
 the active element includes at least one of a field-effect transistor and a diode.   
     
     
         6 . The solid-state image pickup apparatus according to  claim 1 , wherein
 the different wirings include a pulse wiring and a dummy wiring.   
     
     
         7 . An electronic apparatus, comprising:
 a solid-state image pickup apparatus including
 a pixel region in which a plurality of pixels each including a photoelectric conversion element are arranged, 
 transfer wirings formed on the pixel region in parallel to each other with uniform opening widths, and 
 different wirings formed in a wiring layer above the transfer wirings, at least a part of the different wirings being overlapped with the transfer wirings on a plan position, the transfer wirings and the different wirings forming a light shielding structure in the pixel region; and 
   a signal processing circuit configured to process an output signal of the solid-state image pickup apparatus.