US2013233489A1PendingUtilityA1

Apparatus for wet etching while forming interconnect trench in insulating film

Assignee: FUJITSU LTDPriority: Feb 22, 2007Filed: Apr 30, 2013Published: Sep 12, 2013
Est. expiryFeb 22, 2027(~0.6 yrs left)· nominal 20-yr term from priority
H10P 14/69215H10P 14/6922H10P 14/662H10P 72/0426H10P 72/0424H10P 50/287H10P 50/283H10W 20/084H10W 20/081H10W 20/095H01L 21/6708H01L 21/67086
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Claims

Abstract

A wet etching method that includes forming an insulating film on a substrate, and irradiating laser light to the insulating film during wet etching of the insulating film using an etching solution.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A wet etching apparatus, comprising:
 an immersion tank for immersing of a substrate formed on an insulating film in etching solution or a spraying device for spraying of etching solution onto the substrate formed on the insulating film; and   a laser light irradiation device for irradiating of laser light to the substrate during wet etching of the insulating film.   
     
     
         2 . The wet etching apparatus according to  claim 1 , further comprising:
 a lens,   wherein the laser light is irradiated to the insulating film through the lens.   
     
     
         3 . The wet etching apparatus according to  claim 2 ,
 wherein the laser light is irradiated to the insulating film under the condition that the lens contacts the etching solution.   
     
     
         4 . The wet etching apparatus according to  claim 1 ,
 wherein a wavelength of the laser light is in the range of 150 nm to 400 nm.

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