Multilayer ceramic electronic component and method of manufacturing the same

Abstract

There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by T d and the thickness of the internal electrode is denoted by T e , 0.5≦T e /T d ≦2.0, and when the thickness of a central portion of the ceramic body is denoted by T m and the thickness of each of side portions of the ceramic body is denoted by T a , 0.9≦T a /T m ≦0.97, and thus, a multilayer ceramic electronic component having low equivalent series inductance (ESL) may be obtained.

What is claimed is: 
     
         1 . A multilayer ceramic electronic component, comprising:
 a ceramic body having external electrodes; and   internal electrodes disposed between ceramic layers within the ceramic body,   when a direction in which the external electrodes are connected and extended is denoted as a ┌width direction┘; a direction in which the internal electrodes are laminated is denoted as a ┌thickness direction┘; and a direction perpendicular to the width direction and the thickness direction is denoted as a ┌length direction┘, the ceramic body having a width smaller than a length thereof,   the number of the internal electrodes laminated being 250 or more,   when the thickness of the ceramic layer is denoted by T d  and the thickness of the internal electrode is denoted by T e , 0.5≦T e /T d ≦2.0, and   when the thickness of a central portion in a width direction of the ceramic body is denoted by T m  and the thickness of each of side portions of the ceramic body is denoted by T a , in a cross section in a width-thickness direction of the ceramic body, 0.9≦T a /T m ≦0.97.   
     
     
         2 . The multilayer ceramic electronic component of  claim 1 , wherein the central portion in the width direction of the ceramic body is within sections inside 15% of the width of the ceramic body on both sides of a center of the ceramic body in the width direction. 
     
     
         3 . The multilayer ceramic electronic component of  claim 1 , wherein the side portion of the ceramic body is a section within 10% of the width of the ceramic body from each side of the ceramic body in the width direction. 
     
     
         4 . The multilayer ceramic electronic component of  claim 1 , wherein the internal electrode includes a capacitance formation portion forming capacitance by overlapping the internal electrode and an adjacent internal electrode, and a lead-out portion extended from a portion of the capacitance formation portion and led out to an outside of the ceramic body, the lead out portion being thicker than the capacitance formation portion. 
     
     
         5 . The multilayer ceramic electronic component of  claim 1 , wherein the external electrodes are extended onto side surfaces opposing each other in the width direction of the ceramic body and onto portions of the other surfaces adjacent to the side surfaces. 
     
     
         6 . The multilayer ceramic electronic component of  claim 1 , wherein the thickness of the ceramic layer is a thickness of the ceramic layer disposed between the capacitance formation portions of adjacent internal electrodes. 
     
     
         7 . The multilayer ceramic electronic component of  claim 1 , wherein the thickness of the internal electrode is a thickness of the capacitance formation portion of the internal electrode. 
     
     
         8 . The multilayer ceramic electronic component of  claim 1 , wherein the cross section in the width-thickness direction is located within sections inside 40% of the length of the ceramic body on both sides of the center of the ceramic body in the length direction. 
     
     
         9 . A method of manufacturing a multilayer ceramic electronic component, the method comprising:
 preparing a cuboid green chip by laminating 250 or more layers of internal electrodes each interposed between ceramic layers, the cuboid green chip having a smaller width than a length thereof;   compressing side portions in the width direction of the green chip such that a ratio of a thickness of a compressed portion to a thickness of an uncompressed portion is 0.9-0.97;   sintering the green chip; and   forming external electrodes on side surfaces in the width direction of the sintered chip.   
     
     
         10 . The method of  claim 9 , wherein in the preparing of the green chip, adjacent internal electrodes are exposed to opposing surfaces of the green chip, respectively. 
     
     
         11 . The method of  claim 9 , wherein in the preparing of the green chip, the internal electrode is formed such that a lead-out portion thereof is thicker than a capacitance formation portion thereof. 
     
     
         12 . The method of  claim 9 , wherein in the compressing, the compression is performed in a lamination direction of the internal electrodes. 
     
     
         13 . The method of  claim 9 , wherein in the forming of the external electrodes, the external electrodes are extended to portions of the other surfaces adjacent to the side surfaces in the width direction.