Optimized designs for embedding webcam modules with superior image quality in electronics displays

Abstract

The present invention is an apparatus and method of manufacture for providing image capturing modules which can be embedded into thin displays (e.g., in laptop computers) while providing for improved image quality. In accordance with several embodiments, a webcam module embedded in a display has multiple positions. A first position (or a “rest” or “park” position) is the position of the webcam module when it is not in use. In this first position of the webcam module, it is in its most compact configuration, and lends itself to integration into a very thin display. In other positions, the webcam module has a more expanded configuration, thus leading to better image quality. Such an expanded configuration leads, amongst other things, to a larger depth of focus. In one embodiment, a stepped PCB is used to provide good image quality while maintaining a compact form factor as well as structural rigidity.

1 - 18 . (canceled) 
     
     
         19 . An image capturing module, comprising:
 an optics module comprising a sensor and a lens for directing light onto the sensor; and   a stepped substrate coupled to the optics module,   wherein the stepped substrate comprises a thin portion and a thick portion,   wherein the optics module is mounted onto the thin portion, and   wherein the thick portion is disposed opposite at least two sides of the optics module.   
     
     
         20 . The image capturing module of  claim 19 , wherein the stepped substrate is a printed circuit board (PCB) comprising a plurality of layers. 
     
     
         21 . The image capturing module of  claim 20 , wherein the thin portion is comprised of a plurality of PCB layers. 
     
     
         22 . The image capturing module of  claim 20 , wherein the thick portion is comprised of at least one layer of the thin portion and at least one additional layer. 
     
     
         23 . The image capturing module of  claim 22 , wherein the sensor is disposed over the at least one layer of the thin portion and between portions of the at least one additional layer. 
     
     
         24 . The image capturing module of  claim 22 , further comprising a metal stiffener between the at least one layer of the thin portion and the at least one additional layer. 
     
     
         25 . The image capturing module of  claim 20 , wherein the lens and sensor are disposed over the plurality of PCB layers. 
     
     
         26 . The image capturing module of  claim 19 , wherein the thin portion is approximately 0.2 mm thick and the thick portion is approximately 0.8 mm thick. 
     
     
         27 . The image capturing module of  claim 19 , wherein the mounting of the optics module does not overlap the thick portion of the substrate. 
     
     
         28 . A method of manufacturing an image capture module, the method comprising:
 laminating a plurality of layers to form a first portion of a substrate,   adding at least one additional layer to form a second portion of the substrate; and   mounting an optics module onto the first portion of the substrate and with the second portion opposite at least two sides of the optics module.   
     
     
         29 . The method of  claim 28 , wherein the optics module comprises a sensor, a lens, and a lens holder, and mounting the optics module onto the first portion of the substrate further includes disposing the sensor over the first portion of the substrate and at least partially between parts of the second portion. 
     
     
         30 . The method of  claim 28 , wherein the substrate is a printed circuit board. 
     
     
         31 . The method of  claim 28 , wherein the mounting of the optics module does not overlap the second portion of the substrate. 
     
     
         32 . A method of manufacturing an image capture module including an optics module and a substrate having a plurality of printed circuit board (PCB) layers, which form a first portion of the substrate and at least one additional PCB layer partially covering the first portion, the method comprising:
 mounting the optics module onto the first portion of the substrate and with the at least one additional PCB layer opposite at least two sides of the optics module.   
     
     
         33 . The method of  claim 32 , wherein the optics module comprises a sensor, a lens, and a lens holder, and the sensor is disposed over the first portion of the substrate and at least partially between parts of the second portion. 
     
     
         34 . The method of  claim 32 , wherein the mounting of the optics module does not overlap the at least one additional PCB layer.