Photoelectric conversion element unit and image pickup apparatus

Abstract

A photoelectric conversion element unit includes a package includes a package including a photoelectric conversion element configured to perform a photoelectric conversion for an optical image of an object, a substrate mounted with an electronic component that includes a drive circuit configured to drive the photoelectric conversion element and a signal processing circuit configured to process a signal from the photoelectric conversion element, and a fixing plate having an opening, wherein the package and the electronic component are adjacent to each other in a direction orthogonal to an optical axis in the opening, and the package and the substrate are fixed onto the fixing plate.

What is claimed is: 
     
         1 . A photoelectric conversion element unit comprising:
 a package including a photoelectric conversion element configured to perform a photoelectric conversion for an optical image of an object;   a substrate mounted with an electronic component that includes a drive circuit configured to drive the photoelectric conversion element; and   a fixing plate having an opening,   wherein the substrate is provided on the rear surface side of the fixing plate,   wherein the package and the electronic component are provided on the object side of the substrate,   wherein the height of the package in an optical axis direction is larger than the height of the fixing plate in the optical axis direction,   wherein the package and the electronic component are overlapping with the fixing plate as seen from an orthogonal direction of the optical axis,   wherein the package and the electronic component are arranged in the opening,   wherein an adhesive agent is provided in the opening so that the package, the electronic component, and the substrate are fixed to the fixing plate.   
     
     
         2 . An image pickup apparatus comprising a photoelectric conversion element unit,
 wherein the photoelectric conversion element unit includes:   a package including a photoelectric conversion element configured to perform a photoelectric conversion for an optical image of an object;   a substrate mounted with an electronic component that includes a drive circuit configured to drive the photoelectric conversion element; and   a fixing plate having an opening,   wherein the substrate is provided on the rear surface side of the fixing plate,   wherein the package and the electronic component are provided on the object side of the substrate,   wherein the height of the package in an optical axis direction is larger than the height of the fixing plate in the optical axis direction,   wherein the package and the electronic component are overlapping with the fixing plate as seen from an orthogonal direction of the optical axis,   wherein the package and the electronic component are arranged in the opening, and   wherein an adhesive agent is provided in the opening so that the package, the electronic component, and the substrate are fixed to the fixing plate.