US2013222972A1PendingUtilityA1

Laminated ceramic electronic component

Assignee: MURATA MANUFACTURING COPriority: Dec 6, 2010Filed: Apr 4, 2013Published: Aug 29, 2013
Est. expiryDec 6, 2030(~4.4 yrs left)· nominal 20-yr term from priority
H05K 1/162H01G 4/12H01G 4/258H01G 4/1209H01G 4/005H05K 3/4629H01G 4/012H05K 3/1291H05K 3/4664H01G 4/30H05K 3/1216
55
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Claims

Abstract

A laminated ceramic capacitor with a laminated body including a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The laminated body has a pair of mutually opposed principal surfaces extending in the direction in which the ceramic layers extend, a pair of mutually opposed side surfaces and a pair of mutually opposed end surfaces which respectively extend in directions orthogonal to the principal surfaces. The internal electrodes are 0.4 μm or less in thickness, and are located in an area defined by a width-direction gap of 30 μm or less interposed with respect to each of the pair of side surfaces and an outer layer thickness of 35 μm or less interposed with respect to each of the pair of principal surfaces.

Claims

exact text as granted — not AI-modified
1 . A laminated ceramic electronic component comprising:
 a laminated body including a plurality of stacked ceramic layers and a plurality of internal electrodes located between the ceramic layers,   the laminated body having a pair of mutually opposed principal surfaces extending in a direction in which the ceramic layers extend, a pair of mutually opposed side surfaces and a pair of mutually opposed end surfaces, the side surfaces and the end surfaces respectively extending in directions orthogonal to the principal surfaces,   the plurality of internal electrodes including a first set of internal electrodes that extend to a first end surface of the pair of end surfaces and a second set of internal electrodes that extend to a second end surface of the pair of end surfaces, the plurality of internal electrodes being distributed in an area defined by a width-direction gap interposed with respect to each of the pair of side surfaces and an outer layer thickness interposed with respect to each of the pair of principal surfaces,   wherein the plurality of internal electrodes are 0.4 μm or less in thickness, and   at least one of (1) the width-direction gap is 30 μm or less and (2) the outer layer thickness is 35 μm or less.   
     
     
         2 . The laminated ceramic electronic component according to  claim 1 , wherein both the width-direction gap is 30 μm or less and the outer layer thickness is 35 μm or less. 
     
     
         3 . The laminated ceramic electronic component according to  claim 2 , wherein a coverage of the plurality of internal electrodes is 75% or more. 
     
     
         4 . The laminated ceramic electronic component according to  claim 1 , wherein a coverage of the plurality of internal electrodes is 75% or more. 
     
     
         5 . The laminated ceramic electronic component according to  claim 1 , wherein the plurality of internal electrodes are no less than 0.05 μm in thickness. 
     
     
         6 . The laminated ceramic electronic component according to  claim 5 , wherein the width-direction gap is no less than 5 μm. 
     
     
         7 . The laminated ceramic electronic component according to  claim 6 , wherein the outer layer thickness is no less than 5 μm. 
     
     
         8 . The laminated ceramic electronic component according to  claim 1 , wherein the width-direction gap is no less than 5 μm. 
     
     
         9 . The laminated ceramic electronic component according to  claim 1 , wherein the outer layer thickness is no less than 5 μm. 
     
     
         10 . The laminated ceramic electronic component according to  claim 2 , wherein the plurality of internal electrodes are no less than 0.05 μm in thickness. 
     
     
         11 . The laminated ceramic electronic component according to  claim 10 , wherein the width-direction gap is no less than 5 μm. 
     
     
         12 . The laminated ceramic electronic component according to  claim 11 , wherein the outer layer thickness is no less than 5 μm. 
     
     
         13 . The laminated ceramic electronic component according to  claim 2 , wherein the width-direction gap is no less than 5 μm. 
     
     
         14 . The laminated ceramic electronic component according to  claim 2 , wherein the outer layer thickness is no less than 5 μm.

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