Implementing interleaved-dielectric joining of multi-layer laminates

Abstract

A method and apparatus are provided for implementing interleaved-dielectric joining of multi-layer laminates. First and second multi-layer laminates are provided, each having with a laminated portion and an unlaminated portion. The first and second multi-layer laminates are joined together at the unlaminated portions by interleaving a plurality of dielectric layers of the first and second multi-layer laminates. Respective conductors carried by adjacent dielectric layers are connected. The interleaved unlaminated portions are laminated together with heat and pressure, to create a larger laminate of the joined first and second multi-layer laminates.

1 . An apparatus for implementing interleaved-dielectric joining of multi-layer laminates comprising:
 a first multi-layer laminate and a second multi-layer laminate, each of the first multi-layer laminate and the second multi-layer laminate having with a laminated portion and an unlaminated portion; each unlaminated portion including a plurality of dielectric layers;   the first and second multi-layer laminates being joined together at the unlaminated portions by interleaving the plurality of dielectric layers;   a plurality of conductors carried by adjacent dielectric layers being connected, and   the interleaved portions being laminated together with heat and pressure, to create a larger laminate.   
     
     
         2 . The apparatus as recited in  claim 1  includes a solid signal plane carried by one of the plurality of dielectric layers. 
     
     
         3 . The apparatus as recited in  claim 1  wherein said laminated portions and said laminated together interleaved portions have approximately equal thickness. 
     
     
         4 . The apparatus as recited in  claim 1  wherein said laminated portions and said laminated together interleaved portions include an equal number of dielectric layers. 
     
     
         5 . The apparatus as recited in  claim 1  includes a pre-impregnated composite fibers material applied to said interleaved dielectric layers. 
     
     
         6 . The apparatus as recited in  claim 1  wherein each of said plurality of dielectric layers of said unlaminated portion includes an interconnection pad for joining said plurality of conductors carried by adjacent dielectric layers being connected. 
     
     
         7 . The apparatus as recited in  claim 1  wherein said plurality of conductors carried by adjacent dielectric layers is connected using ultrasonic welding (USW). 
     
     
         8 . The apparatus as recited in  claim 1  wherein said plurality of conductors carried by adjacent dielectric layers is connected using plated through holes. 
     
     
         9 . The apparatus as recited in  claim 1  wherein said laminated together interleaved portions are drilled and plated using a plated through hole (PTH) process, creating a PTH connection between the conductors carried by adjacent dielectric layers. 
     
     
         10 - 18 . (canceled)