Method of manufacturing semiconductor package

Abstract

A method of manufacturing a semiconductor package, the method including: disposing a plurality of semiconductor chips; forming a sealing part sealing the plurality of semiconductor chips; forming a substrate part on at least one surface of the sealing part; and forming an antenna part on the sealing part or the substrate part.

What is claimed is: 
     
         1 . A method of manufacturing a semiconductor package, the method comprising:
 disposing a plurality of semiconductor chips;   forming a sealing part sealing the plurality of semiconductor chips;   forming a substrate part on at least one surface of the sealing part; and   forming an antenna part on the sealing part or the substrate part.   
     
     
         2 . The method of  claim 1 , wherein the disposing of the plurality of semiconductor chips includes arranging semiconductor chips sorted into good products on a carrier. 
     
     
         3 . The method of  claim 2 , wherein the disposing of the plurality of semiconductor chips includes attaching the semiconductor chips to an adhesive layer formed on the carrier. 
     
     
         4 . The method of  claim 1 , wherein the forming of the sealing part includes forming the sealing part using an epoxy mold compound (EMC). 
     
     
         5 . The method of  claim 1 , further comprising, after the forming of the sealing part, forming a via connection part penetrating through the sealing part. 
     
     
         6 . The method of  claim 5 , wherein the forming of the antenna part includes electrically connecting the antenna part and the semiconductor chips through the via connection part. 
     
     
         7 . The method of  claim 1 , wherein the forming of the substrate part includes forming a multi-layer substrate part on each of upper and lower surfaces of the sealing part. 
     
     
         8 . The method of  claim 7 , wherein the forming of the antenna part includes forming a plurality of radiators on several layers of the substrate part. 
     
     
         9 . The method of  claim 1 , wherein the forming of the antenna part includes forming a groove in an outer surface of the sealing part and forming the antenna part therein. 
     
     
         10 . The method of  claim 1 , wherein the forming of the substrate part includes repeatedly forming fine circuit patterns and insulating layers through a semiconductor manufacturing process