Interface module and manufacturing method thereof

Abstract

An interface module is provided. The interface module includes a substrate and a flexible print circuit board. The substrate includes a first side, a second side, a plurality of column electrodes and a plurality of row electrodes, wherein the first side is perpendicular to the second side, the column electrodes are formed on the substrate and arranged along the first side, and the row electrodes are formed on the substrate and arranged along the second side. The flexible print circuit board includes a first connection portion and a second connection portion, wherein the first connection portion is electrically connected to the column electrodes at the first side, and the second connection portion is electrically connected to at least a portion of the row electrodes at the second side.

What is claimed is: 
     
         1 . An interface module, comprising:
 a substrate, comprising a first side, a second side, a plurality of column electrodes and a plurality of row electrodes, wherein the first side is perpendicular to the second side, the column electrodes are formed on the substrate and arranged along the first side, and the row electrodes are formed on the substrate and arranged along the second side;   a flexible print circuit board, comprising a first connection portion and a second connection portion, wherein the first connection portion is electrically connected to the column electrodes at the first side, and the second connection portion is electrically connected to at least a portion of the row electrodes at the second side.   
     
     
         2 . The interface module as claimed in  claim 1 , wherein the column electrodes and the row electrodes are respectively data lines and scan lines. 
     
     
         3 . The interface module as claimed in  claim 1 , wherein the column electrodes or the row electrodes are sensing electrodes. 
     
     
         4 . The interface module as claimed in  claim 1 , wherein the flexible print circuit board is integrally formed. 
     
     
         5 . The interface module as claimed in  claim 1 , further comprising an integrated circuit, wherein the integrated circuit is disposed on the first side of the substrate, the column electrodes are electrically connected to the integrated circuit, the first connection portion is electrically connected to the integrated circuit, the integrated circuit outputs a row signal, and the row signal is transmitted to one of the row electrodes via the second connection portion of the flexible print circuit board. 
     
     
         6 . The interface module as claimed in  claim 1 , wherein the substrate comprises a third side, the third side is parallel to the second side, the flexible print circuit board further comprises a third connection portion, and the third connection portion is electrically connected to at least a portion of the row electrodes at the third side. 
     
     
         7 . The interface module as claimed in  claim 6 , wherein the interface module comprises an interface side and a back side, the interface side is opposite to the back side, and at least a portion of the second connection portion and the third connection portion are bent to contact the back side. 
     
     
         8 . The interface module as claimed in  claim 1 , wherein the interface module comprises an interface side and a back side, the interface side is opposite to the back side, and at least a portion of the second connection portion is bent to contact the back side. 
     
     
         9 . An interface module, comprising:
 a first substrate, comprising a first side and a plurality of column electrodes, wherein the column electrodes are formed on the first substrate and arranged along the first side, and the column electrodes are extended to a first edge of the first side;   a second substrate, comprising a second side and a plurality of row electrodes, wherein the row electrodes are formed on the second substrate and arranged along the second side, the row electrodes are extended to a second edge of the second side, and the first side is perpendicular to the second side; and   a flexible print circuit board, comprising a first connection portion and a second connection portion, wherein the first connection portion is electrically connected to the column electrodes at the first side, and the second connection portion is electrically connected to at least a portion of the row electrodes at the second side.   
     
     
         10 . The interface module as claimed in  claim 9 , wherein the column electrodes or the row electrodes are sensing electrodes. 
     
     
         11 . The interface module as claimed in  claim 9 , wherein the flexible print circuit board is integrally formed. 
     
     
         12 . The interface module as claimed in  claim 9 , wherein the second substrate comprises a third side, the third side is parallel to the second side, the row electrodes are extended to a third edge of the third side, the flexible print circuit board further comprises a third connection portion, and the third connection portion is electrically connected to at least a portion of the row electrodes at the third side. 
     
     
         13 . The interface module as claimed in  claim 12 , wherein the interface module comprises an interface side and a back side, the interface side is opposite to the back side, and at least a portion of the second connection portion and the third connection portion are bent to contact the back side. 
     
     
         14 . The interface module as claimed in  claim 9 , wherein the interface module comprises an interface side and a back side, the interface side is opposite to the back side, and at least a portion of the second connection portion is bent to contact the back side. 
     
     
         15 . A method for manufacturing an interface module, comprising:
 providing a first substrate and a second substrate, wherein the first substrate comprises a first side and a plurality of column electrodes, the column electrodes are formed on the first substrate and arranged along the first side, and the column electrodes are extended to a first edge of the first side, the second substrate comprises a second side and a plurality of row electrodes, the row electrodes are formed on the second substrate and arranged along the second side, and the row electrodes are extended to a second edge of the second side; and   overlapping the first substrate with the second substrate, wherein the first side Is perpendicular to the second side;   providing a flexible print circuit board, wherein the flexible print circuit board comprises a first connection portion and a second connection portion   electrically connecting the first connection portion to the column electrodes at the first side; and   electrically connecting the second connection portion to at least a portion of the row electrodes at the second side.   
     
     
         16 . The method as claimed in  claim 15 , wherein the flexible print circuit board is integrally formed. 
     
     
         17 . The method as claimed in  claim 15 , wherein the second substrate comprises a third side, the third side is parallel to the second side, the row electrodes are extended to a third edge of the third side, the flexible print circuit board further comprises a third connection portion, and the third connection portion is electrically connected to at least a portion of the row electrodes at the third side. 
     
     
         18 . The method as claimed in  claim 17 , wherein the interface module comprises an interface side and a back side, the interface side is opposite to the back side, and at least a portion of the second connection portion and the third connection portion are bent to contact the back side. 
     
     
         19 . The method as claimed in  claim 15 , wherein the interface module comprises an interface side and a back side, the interface side is opposite to the back side, and at least a portion of the second connection portion is bent to contact the back side. 
     
     
         20 . The method as claimed in  claim 15 , wherein the first substrate and the second substrate are formed by a roll to roll process.