Method and apparatus for interrogating an electronic component

Abstract

A method and apparatus for interrogating an electronic component, includes a body having an interface for an interrogating device to use as a conduit in reliably performing multiple discrete interrogations of the electronic component without the interrogating device physically touching the electronic component.

What is claimed is: 
     
         1 . An apparatus for interrogating an electronic component, comprising:
 an electronic component comprising one or more discrete circuits on a substrate suitable for being packaged in an integrated circuit package;   a body functioning as a test access port or system access port on the substrate, the body being connected to one or more discrete circuit of the electronic component, the body being separate and distinct from an interrogating device, the body having an interface for wireless communication with the interrogating device, the body having a logic circuit for converting instructions from the interrogating device into control signals, communication signals or both to be applied to the discrete circuits.   
     
     
         2 . The apparatus of claim  23 , wherein the body is a bare die mounted to the substrate. 
     
     
         3 . The apparatus of claim  23 , wherein the body is incorporated within an integrated circuit that performs other functions. 
     
     
         4 . The apparatus of claim  23 , wherein the body is integrally formed within the substrate. 
     
     
         5 . The apparatus of claim  23 , wherein the body is a discrete component positioned upon an integrated circuit. 
     
     
         6 . The apparatus of claim  23 , wherein the interface includes at least one of a transmitter, a receiver, and a transceiver. 
     
     
         7 . The apparatus of claim  28 , wherein the interface includes at least one transceiver having a separate transmitter circuit and a separate receiver circuit. 
     
     
         8 . The apparatus of claim  23 , wherein the interface comprises an antenna for capacitive coupling, inductive coupling, or transmitting electromagnetic waves. 
     
     
         9 . The apparatus of claim  23 , wherein the logic circuit includes a pattern generator. 
     
     
         10 . The apparatus of claim  23 , wherein the body has an output verification circuit for verifying the outputs of the electronic component. 
     
     
         11 . The apparatus of claim  23 , wherein the body has at least one of an analog to digital converter or a digital to analog converter. 
     
     
         12 . The apparatus of claim  23 , wherein the interface comprises a wireless communication block having a transmitter and a receiver. 
     
     
         13 . The apparatus of claim  23 , wherein the body includes a wired input adapted to receive at least one of data and power. 
     
     
         14 . The apparatus of claim  35 , wherein the wired input is contact pad. 
     
     
         15 . The apparatus of claim  35 , wherein the wired input is a multi-contact panel. 
     
     
         16 . The apparatus of claim  23 , wherein the substrate comprises more than one discrete circuit. 
     
     
         17 . The apparatus of claim  38 , wherein the body enables the more than one discrete circuits to be interrogated at least one of in parallel or in series, or individually. 
     
     
         18 . The apparatus of claim  23 , wherein the body is wirebonded to the electronic component. 
     
     
         19 . The apparatus of claim  23 , wherein the body is in a flipchip arrangement with the electronic component. 
     
     
         20 . The apparatus of claim  23 , wherein the interface comprises multiple antennas connected for communicating with an interrogating device in parallel across multiple channels. 
     
     
         21 . The apparatus of claim  23 , wherein the electronic component comprises an integrated circuit package that includes the body, the substrate and the discrete circuits.