Heat dissipating module

Abstract

A heat dissipating module includes a base, at least one thermal conductive element, at least one liquid-pipe and a heat sink. The thermal conductive element is disposed at the base. The liquid-pipe is disposed adjacent to the thermal conductive element. The liquid-pipe is disposed at the base. The heat sink covers the thermal conductive element and the liquid-pipe. A part of the heat sink is connected to the base. The heat sink includes a plurality of fins. The heat dissipating module combines air-cooling with water-cooling so as to enhance thermal conductivity.

What is claimed is: 
     
         1 . A heat dissipating module disposed at a circuit board, comprising:
 a base;   at least a thermal conductive element disposed at the base;   at least a liquid-pipe adjacent to the thermal conductive element and disposed at the base; and   a heat sink covering the thermal conductive element and the liquid-pipe, wherein at least a part of the heat sink is connected to the base, and the heat sink includes a plurality of fins.   
     
     
         2 . The heat dissipating module according to  claim 1 , wherein two ends of the liquid-pipe have a joint, respectively. 
     
     
         3 . The heat dissipating module according to  claim 1 , wherein the thermal conductive element includes a heat pipe or a thermal conductive sheet. 
     
     
         4 . The heat dissipating module according to  claim 1 , wherein the base includes at least two recesses, the recesses contact with and accommodate the thermal conductive element and the liquid-pipe, respectively, and the recesses are disposed at a same surface with the base. 
     
     
         5 . The heat dissipating module according to  claim 1 , wherein the heat dissipating module further includes:
 a liquid cooling set connected to the liquid-pipe.   
     
     
         6 . The heat dissipating module according to  claim 1 , wherein the fins includes at least two recesses, and the recesses contact with the thermal conductive element and the liquid-pipe, respectively. 
     
     
         7 . The heat dissipating module according to  claim 1 , wherein the liquid-pipe is integrally formed along three directions of an x-y-z coordinate. 
     
     
         8 . A heat dissipating module disposed at a circuit board, comprising:
 a base;   at least a thermal conductive element disposed at the base;   a heat sink covering the thermal conductive element, wherein at least a part of the heat sink is connected to the base, the heat sink includes a plurality of fins, and the fins includes multiple recesses, respectively; and   at least a liquid-pipe disposed in the recesses of the fins,   wherein the recesses of the heat sink cover the thermal conductive element and the liquid-pipe.   
     
     
         9 . The heat dissipating module according to  claim 8 , wherein two ends of the liquid-pipe have a joint, respectively. 
     
     
         10 . The heat dissipating module according to  claim 8 , wherein the thermal conductive element includes a heat pipe or a thermal conductive sheet. 
     
     
         11 . The heat dissipating module according to  claim 8 , wherein the base includes at least a recess, and the recess contacts with and accommodates the thermal conductive element. 
     
     
         12 . The heat dissipating module according to  claim 8 , wherein the heat dissipating module further includes:
 a liquid cooling set connected to the liquid-pipe.   
     
     
         13 . The heat dissipating module according to  claim 8 , wherein the recess of the heat sink contacts with the liquid-pipe. 
     
     
         14 . The heat dissipating module according to  claim 8 , wherein the liquid-pipe is integrally formed along three directions of an x-y-z coordinate.