Wafer pocket with tear-open wafer accommodating compartment

Abstract

In order to be able to remove a wafer 4 conveniently from a wafer pocket 1 , it is proposed that the wafer pocket 1 be formed by a first enveloping film 9 and a second enveloping film 11 , which are connected to one another via at least one connecting region 2 , such that a wafer accommodating compartment 3 which is suitable for accommodating the wafer 4 and which is sealed off toward the outside is formed between the first enveloping film 9 and the second enveloping film 11 , at least one of the enveloping films 9, 11 being weakened within a weakening region 5 located in the region of the wafer accommodating compartment 3 , such that the wafer accommodating compartment 3 can be opened by tearing open the wafer pocket 1 along a tearing line that passes the weakening region 5 . In order furthermore to ensure that the outer sides of the wafer pocket 1 are esthetically attractive and to meet the requirements made of necessary identification obligations, the weakening region 5 is spaced apart from each edge of the wafer pocket 1 . Moreover, the tearing line additionally runs partly outside the weakening region.

1 . A wafer pocket formed by a first and a second enveloping film, which are connected to one another via at least one connecting region, such that a wafer accommodating compartment which is suitable for accommodating a wafer and which is sealed off toward the outside is formed between the first enveloping film and the second enveloping film, at least one of the enveloping films being weakened within a weakening region located in the region of the wafer accommodating compartment, such that the wafer accommodating compartment can be opened by tearing open the wafer pocket along a tearing line that passes the weakening region, characterized in that the weakening region is spaced apart from each edge of the wafer pocket, and the tearing line additionally runs partly outside the weakening region. 
     
     
         2 . The wafer pocket as claimed in  claim 1 , characterized in that the weakening region is made in the form of a weakening line or in the form of a weakening area. 
     
     
         3 . The wafer pocket as claimed in  claim 1 , characterized in that the first enveloping film and/or the second enveloping film is/are biaxially oriented. 
     
     
         4 . The wafer pocket as claimed in  claim 2 , characterized in that the first and/or the second enveloping film is/are oriented in a direction at right angles to at least one edge of the wafer pocket. 
     
     
         5 . The wafer pocket as claimed in  claim 3 , characterized in that on at least one edge of the wafer pocket there is an edge weakening, from which the first enveloping film and the second enveloping film can be torn through. 
     
     
         6 . The wafer pocket as claimed in  claim 5 , characterized in that the edge weakening is formed by a notch or a cut on at least one edge of the wafer pocket. 
     
     
         7 . The wafer pocket as claimed in  claim 6 , characterized in that the edge weakening is located within the connecting region. 
     
     
         8 . The wafer pocket as claimed in  claim 1 , characterized in that the weakening region causes a deflection of the tearing line as the wafer pocket is torn open. 
     
     
         9 . The wafer pocket as claimed in  claim 8 , characterized in that the weakening region is formed by a deflection line or a deflection area, and in that the deflection line or the deflection area connects together a first tearing line section and a second tearing line section, which run substantially at right angles to one another. 
     
     
         10 . The wafer pocket as claimed in  claim 8 , characterized in that the deflection area has an outer boundary line, on which the tearing line is deflected from the first tearing line section to the second tearing line section. 
     
     
         11 . The wafer pocket as claimed in  claim 1 , characterized in that the weakening region is formed by a deflection line, and in that the deflection line has ends in the region of the wafer accommodating compartment, first and second tangents to the respective ends of the deflection line running at right angles to one another, and the first tangent forming a first tearing line section and the second tangent forming a second tearing line section. 
     
     
         12 . The wafer pocket as claimed in  claim 1 , characterized in that the weakening region is formed by a deflection line or a deflection area, and in that the deflection line or the deflection area is a scribing structure which is formed by the action of a laser beam on the first enveloping film and/or the second enveloping film. 
     
     
         13 . The wafer pocket as claimed in  claim 1 , characterized in that the deflection line or the deflection area is formed in only one of the enveloping films. 
     
     
         14 . The wafer pocket as claimed in  claim 1 , characterized in that the wafer pocket is separably connected to a tear-off section on one side. 
     
     
         15 . The wafer pocket as claimed in  claim 14 , characterized in that the wafer pocket is connected to the tear-off section via at least one perforation. 
     
     
         16 . The wafer pocket as claimed in clam  1 , characterized in that the first enveloping film and the second enveloping film each have a printable polymer layer on the sides facing outward. 
     
     
         17 . The wafer pocket as claimed in  claim 1 , characterized in that there is a wafer in the wafer accommodating compartment.