Apparatus and a method for treating a substrate

Abstract

A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.

1 .- 9 . (canceled) 
     
     
         10 . A substrate treating apparatus comprising:
 a supporting unit configured to support a substrate;   a nozzle unit configured to jet a fluid containing an abrasive onto the substrate; and   a supplying unit configured to supply the fluid to the nozzle unit.   
     
     
         11 . The apparatus of  claim 10 , wherein the supplying unit comprises a first storage configured to store a solvent, a second storage configured to store the abrasive, a first supplying conduit configured to connect the first storage to the nozzle unit, and a second supplying conduit configured to connect the second storage to the first supplying conduit. 
     
     
         12 . The apparatus of  claim 11 , wherein the second storage stores a chemical, wherein the chemical softens a layer provided on the substrate. 
     
     
         13 . The apparatus of  claim 11 , wherein the second storage stores an additive, wherein the additive protects a surface of the substrate or a layer provided on the substrate. 
     
     
         14 . The apparatus of  claim 11 , wherein the supplying unit further comprises valves provided on the first and second supplying conduits and a controller, wherein the controller controls the valves to adjust a content of the abrasive in the fluid. 
     
     
         15 . The apparatus of  claim 10 , wherein the nozzle unit includes an end portion through which the fluid is jetted, and wherein the end portion of the nozzle unit is located at the same or substantially the same level as a top surface of the substrate and faces a side surface of the supporting unit. 
     
     
         16 . A substrate treating apparatus comprising:
 a first module configured to jet a fluid containing an abrasive through a nozzle to a substrate; and   an second module configured to transfer the substrate to the first module, wherein the nozzle is positioned over a top surface of the substrate or is positioned adjacent to a side of the substrate.   
     
     
         17 . The substrate treating apparatus of  claim 16 , wherein the fluid includes chemical-mechanical polishing (CMP) slurry. 
     
     
         18 . The substrate treating apparatus of  claim 16 , wherein the fluid includes a solvent, a chemical, or an additive. 
     
     
         19 . The substrate treating apparatus of  claim 18 , wherein the chemical includes KOH, HF, H 2 O 2 , NH 4 OH, HCl, or H 2 SO 4 . 
     
     
         20 . The substrate treating apparatus of  claim 18 , wherein the additive includes polyacrylic acid (PAA) or polyethyleneimine (PIE).