Coaxial plated through holes (pth) for robust electrical performance

Abstract

In some embodiments, coaxial plated through holes (PTH) for robust electrical performance are presented. in this regard, an apparatus is introduced comprising an integrated circuit device and a substrate coupled with the integrated circuit device, wherein the substrate includes: a plated through hole, the plated through hole filled with dielectric material and a coaxial copper wire, and conductive traces to separately route the plated through hole and the coaxial copper wire. Other embodiments are also disclosed.

What is claimed is: 
     
         1 . A method comprising:
 drilling a through hole in a substrate core;   plating the drilled through hole;   filling the plated through hole with dielectric material and a coiled copper wire;   patterning a surface of the substrate core to route the plated through hole and the copper wire; and   forming build-up layers on the patterned surface to form a substrate.   
     
     
         2 . The method of  claim 1 , further comprising coupling an integrated circuit device to the substrate. 
     
     
         3 . The method of  claim 2 , further comprising routing the plated through hole to couple with a ground contact of the integrated circuit device. 
     
     
         4 . The method of  claim 2 , further comprising routing the plated through hole and the copper wire to couple with differential pair contacts of the integrated circuit device. 
     
     
         5 . The method of  claim 1 , wherein filling the plated through hole with dielectric material and a coaxial copper wire comprises placing a preformed encapsulant containing a copper wire into the plated through hole. 
     
     
         6 . The method of  claim 1 , wherein filling the plated through hole with dielectric material and a coaxial copper wire comprises:
 plugging the plated through hole with dielectric material;   laser drilling a hole through a length of the dielectric material; and   plating the laser drilled hole.   
     
     
         7 . A method comprising:
 drilling a through hole in a substrate core;   plating the drilled through hole;   filling the plated through hole with dielectric material and a preformed encapsulant containing a conductor into the plated through hole;   patterning a surface of the substrate core to route the plated through hole and the conductor; and   forming build-up layers on the patterned surface to form a substrate.   
     
     
         8 . The method of  claim 7 , wherein filling the plated through hole includes picking an placing the preformed encapsulant using one or more magnetic plugs. 
     
     
         9 . The method of  claim 7 , wherein filling the plated through hole with dielectric material and the preformed encapsulant containing the conductor into the plated through hole includes filling the plated through hole with dielectric material and a preformed encapsulant containing a copper wire. 
     
     
         10 . The method of  claim 7 , wherein filling the plated through hole with dielectric material and a preformed encapsulant containing a conductor into the plated through hole includes filling the plated through hole with dielectric material and a preformed encapsulant containing a coiled copper wire inductor. 
     
     
         11 . The method of  claim 7 , wherein drilling a through hole in a substrate core includes laser drilling. 
     
     
         12 . The method of  claim 7 , wherein filling the plated through hole with dielectric material includes flowing and curing a dielectric material.