Device for cutting a substrate and method for controlling such a cutting device

Abstract

A device for cutting a substrate along a cutting line is disclosed. The device includes a saw unit with a saw blade, which can be rotated around an axis of rotation, a guide carriage for moving the saw unit along a guide rail, and a control device for controlling the saw unit and the guide carriage. A marking device is provided for marking an end point of the cutting line.

What is claimed is: 
     
         1 . A device for cutting a substrate along a cutting line, comprising:
 a saw unit with a saw blade, wherein the saw blade is rotatable around an axis of rotation;   a guide carriage, wherein the saw unit is movable by the guide carriage along a guide rail;   a control device, wherein the saw unit and the guide carriage are controllable by the control device; and   a marking device associated with the guide rail, wherein an end point of the cutting line is markable by the marking device.   
     
     
         2 . The device according to  claim 1 , further comprising a second marking device associated with the guide rail, wherein a second end point of the cutting line is markable by the second marking device. 
     
     
         3 . The device according to  claim 1 , wherein the marking device has an optical marking element, a signal generator, and a detector device, wherein the end point is optically markable by the optical marking element, wherein a position signal corresponding to a position of the end point or a position of a reference point which is arranged at a defined distance from the end point is emittable by the signal generator, and wherein the position signal is receivable by the detector device. 
     
     
         4 . The device according to  claim 3 , wherein the detector device is connectable to the control device and wherein information corresponding to the position signal is transmittable to the control device by the detector device. 
     
     
         5 . The device according to  claim 2 , wherein the marking device and the second marking device have a common detector device. 
     
     
         6 . The device according to  claim 3 , wherein the optical marking element is movable on the guide rail by a movement device. 
     
     
         7 . The device according to  claim 3 , further comprising a mechanical end stop connected to the optical marking element. 
     
     
         8 . The device according to  claim 3 :
 wherein the signal generator has a transmitting unit, wherein a measuring beam is transmittable by the transmitting unit, and a measurement object;   and wherein the detector device has a receiving unit and an evaluation device.   
     
     
         9 . The device according to  claim 8 , wherein the transmitting unit, the receiving unit, and the evaluation device form a laser distance measuring system or an ultrasonic distance measuring system. 
     
     
         10 . A method for controlling a cutting device, comprising the steps of:
 generating a position signal by a signal generator, wherein the position signal corresponds to a position of an end point of a cutting line on a substrate;   receiving the position signal by a detector device;   transmitting information corresponding to the position signal to a control device by the detector device; and   controlling a drive device of the cutting device by the control device based on the transmitted information.   
     
     
         11 . The method according to  claim 10 , wherein the end point of the cutting line is marked by a marking device. 
     
     
         12 . The method according to  claim 10 :
 wherein the signal generator has a transmitting unit and a measurement object;   and wherein the detector device has a receiving unit and an evaluation device.