US2013178558A1PendingUtilityA1
Thermoset dampener material
Est. expiryAug 2, 2027(~1 yrs left)· nominal 20-yr term from priority
C08G 59/4042C09D 159/00C09D 125/06C09D 165/00C09D 161/02C08L 65/00C08L 63/00C09D 181/06C08G 2261/3444C08G 59/5086C09D 163/00C09D 179/08C09D 181/04C09D 169/00C09D 171/08
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Claims
Abstract
Thermoset compositions useful for dampening vibrations at elevated temperatures are disclosed. The thermoset compositions may have a glass transition temperature of 150° C. or greater, a tan δ peak of 0.2 or greater, and a tan δ peak width measured at half-height larger than about 40° C., as measured by dynamic thermo-mechanical analysis (DMTA) at a frequency of 1 Hz. The thermoset compositions may be used to dampen vibrations at temperatures in excess of 100° C.
Claims
exact text as granted — not AI-modifiedWhat is claimed:
1 . A composite having improved dampening properties at elevated temperatures, comprising:
a thermoset composition disposed on a substrate to form the composite; the thermoset composition having:
a glass transition temperature of 150° C. or greater,
a tan δ peak of 0.2 or greater, and
a tan δ peak width measured at half-height larger than about 40° C., as measured by dynamic thermo-mechanical analysis (DMTA) at a frequency of 1 Hz; wherein the composite is exposed to vibrations at temperatures of 100° C. or greater.
2 . The composite of claim 1 , wherein the thermoset composition comprises:
a crosslinked composition comprising the reaction product of a curable composition comprising at least one thermosetting resins and at least one hardener; wherein the thermosetting resin comprising at least one of an epoxy, a phenolic resin, a vinylic resin, a cycloaliphatic epoxy resin, and a cyanate ester-based resin.
3 . The composite of claim 2 , wherein the thermoset composition further comprises a high temperature resistant thermoplastic resin.
4 . The composite of claim 3 , wherein the high temperature resistant thermoplastic resin is selected from the group consisting of a polyetherimides, a polyphenylene ether, a polyoxyphenylene, a polysulphone, a syndiotactic polystyrene, a polyaryl ether ketone, a polycarbonate, an acetal, a polyimide, and a polyarylene sulfide.
5 . The composite of claim 1 , wherein the thermoset composition further comprises at least one of a catalyst, an inorganic filler, a solvent, a toughening agent, and a fibrous reinforcement.
6 . A thermoset composition having improved dampening properties at elevated temperatures, comprising:
a reaction product of a curable composition comprising at least one thermosetting resin and at least one hardener; wherein the thermoset composition has:
a glass transition temperature of 150° C. or greater,
a tan δ peak of 0.2 or greater, and
a tan δ peak width measured at half-height larger than about 40° C., as measured by dynamic thermo-mechanical analysis (DMTA) at a frequency of 1 Hz.
7 . The thermoset composition of claim 6 , wherein the at least one thermosetting resin is selected from the group consisting of an epoxy, a phenolic resin, a vinylic resin, a cycloaliphatic epoxy resin, and a cyanate ester-based resin.
8 . The thermoset composition of claim 7 , wherein the curable composition further comprises a high temperature resistant thermoplastic resin.
9 . The thermoset composition of claim 8 , wherein the high temperature resistant thermoplastic resin is selected from the group consisting of a polyetherimides, a polyphenylene ether, a polyoxyphenylene, a polysulphone, a syndiotactic polystyrene, a polyaryl ether ketone, a polycarbonate, an acetal, a polyimide, and a polyarylene sulfide.
10 . The thermoset composition of claim 6 , wherein the curable composition further comprises at least one of a catalyst, an inorganic filler, a solvent, a toughening agent, and a fibrous reinforcement.Join the waitlist — get patent alerts
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