Diffusion bonding machine and method

Abstract

An example diffusion bonding machine includes a support structure configured to receive first and second die sets. A heat transfer device is arranged near the support structure and is configured to transfer heat relative to the die sets. A mechanism is configured to separate the die sets from one another during heat transfer. In one example method of diffusion bonding, heat is transferred relative to a space between die sets. The die sets are supported on the support structure, and a load is applied to the die sets to diffusion bond a component within each of the die sets.

What is claimed is:  
     
         1 . A method of diffusion bonding a component comprising:
 transferring heat relative to a space between first and second die sets;   supporting the first die set on the second die set; and   applying a load to the die sets to diffusion bond a component within each of the die sets.   
     
     
         2 . The method according to  claim 1 , comprising loading the die sets onto a support structure prior to performing the heat transferring step. 
     
     
         3 . The method according to  claim 2 , comprising moving the die sets and support structure relative to one another to provide a space. 
     
     
         4 . The method according to  claim 3 , wherein the moving step includes lifting the die sets off of a platen. 
     
     
         5 . The method according to  claim 2 , wherein the heat transferring step includes heating the space and the die sets. 
     
     
         6 . The method according to  claim 2 , wherein the heat transferring step includes cooling the space and the die sets. 
     
     
         7 . The method according to  claim 1 , wherein the loading step includes pressing the die sets between first and second platens. 
     
     
         8 . The method according to  claim 1 , comprising transferring heat relative to a space between the die sets prior to and subsequent to the load applying step. 
     
     
         9 . The method according to  claim 1 , wherein the load applying step includes heating the die sets. 
     
     
         10 . The method according to  claim 1 , wherein the heat transferring step, the die sets supporting step, and the load applying step are performed at a single station.