Ultrasonic probe and method of manufacturing the same

Abstract

According to one embodiment, an ultrasonic probe includes a plurality of piezoelectric elements, a first electrode, a plurality of second electrodes, a plurality of stacked flexible printed circuit boards, and a plurality of connection portions. The plurality of piezoelectric elements are arrayed. The first electrode is provided on the emitting surface side of the plurality of piezoelectric elements. The plurality of second electrodes are respectively provided on the rear surface sides of the plurality of piezoelectric elements. The plurality of stacked flexible printed circuit boards respectively include a plurality of terminals. The plurality of connection portions electrically connect the second electrodes to the terminals. At least one of the flexible printed circuit boards extends longer than the flexible printed circuit board serving as an upper layer.

What is claimed is: 
     
         1 . A method of manufacturing an ultrasonic probe, the method comprising:
 bonding a flat piezoelectric layer, an electrode provided on a rear surface of the piezoelectric layer, and a connection layer configured to connect a plurality of terminals provided on a plurality of stacked flexible printed circuit boards to the electrode;   forming a plurality of predetermined steps in a rear surface of the connection layer;   forming a plurality of connection portions by dividing the connection layer into a lattice pattern;   exposing a flexible printed circuit board of the flexible printed circuit boards which is a lower layer;   making the terminals face the connection portions, respectively; and   bonding the terminals, which are made to face the connection portions, to the respective connection portions.   
     
     
         2 . The method according to  claim 1 , wherein the connection layer is bonded to a partial region of the electrode. 
     
     
         3 . A method of manufacturing an ultrasonic probe, the method comprising:
 dividing a connection layer into a plurality of connection portions, the connection layer being configured to connect a plurality of terminals provided on a plurality of stacked flexible printed circuit boards to an electrode provided on a rear surface of a piezoelectric layer;   classifying the connection portions into a plurality of groups;   providing the connection portions of the groups with different thicknesses;   bonding the connection portions, the flat piezoelectric layer, and the electrode to one another;   exposing a lower one of the flexible printed circuit boards;   making the terminals face the connection portions, respectively; and   bonding the terminals, which are made to face the connection portions, to the respective connection portions.