Circuit substrate

Abstract

A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and a chip component that is provided on a surface of the laminate substrate and is connected to the filter chip, at least a part of the chip component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.

What is claimed is: 
     
         1 . A circuit substrate comprising:
 a laminate substrate in which a conductive layer and an insulating layer are laminated;   a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and   a chip component that is provided on a surface of the laminate substrate and is connected to the filter chip, at least a part of the chip component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.   
     
     
         2 . The circuit substrate as claimed in  claim 1 , wherein whole of the chip component is inside of the projected region. 
     
     
         3 . The circuit substrate as claimed in  claim 1 , wherein whole of a plurality of the chip components is inside of the projected region. 
     
     
         4 . The circuit substrate as claimed in  claim 1 , wherein the filter chip is directly connected to the chip component not through another chip component. 
     
     
         5 . The circuit substrate as claimed in  claim 1 , wherein a plurality of the filter chips include a transmit filter chip having a transmit filter and a receive filter chip having a receive filter. 
     
     
         6 . The circuit substrate as claimed in  claim 5 , wherein:
 the transmit filter chip is connected between a transmit node and a common node;   the receive filter chip is connected between a receive node and the common node;   a plurality of the chip components include a first chip component connected between the common node and an antenna, a second chip component connected between the transmit node and an electronic component, and a third chip component connected between the receive node and the electronic component;   the first chip component overlaps with one of a first projected region that is a region of the transmit filter chip projected in the thickness direction of the laminate substrate and a second projected region that is a region of the receive filter chip projected in the thickness direction of the laminate substrate;   the second chip component overlaps with the first projected region; and   the third chip component overlaps with the second projected region.   
     
     
         7 . The circuit substrate as claimed in  claim 1 , wherein:
 interconnection lines connecting the filter chip and the chip component includes a first interconnection line extending in a face direction of the laminate substrate and a second interconnection line extending in the thickness direction of the laminate substrate; and   the first interconnection line is shorter than the second interconnection line.   
     
     
         8 . The circuit substrate as claimed in  claim 1 , wherein:
 the laminate substrate includes a core made of a metal; and   the filter chip is provided inside of an opening formed in the core.