Parallel optical transceiver module that utilizes a folded flex circuit that reduces the module footprint and improves heat dissipation

Abstract

A parallel optical transceiver module is provided that uses a folded flex circuit arrangement that reduces the footprint of the transceiver module while also providing the module with improved heat dissipation characteristics. In addition, the manner in which components are mounted on the flex circuit facilitates assembly of the module, reducing the overall cost of the module while improving manufacturing yield.

What is claimed is: 
     
         1 . A parallel optical transceiver module comprising:
 a folded flex circuit having at least upper and lower surfaces and having at least first, second, third, fourth, and fifth flex circuit portions, the flex circuit having a flexible substrate of dielectrically insulating material and a plurality of electrical conductors disposed in or on the substrate, and wherein the first and fifth flex circuit portions extend generally in respective planes that are generally co-planar to one another and generally parallel to a plane in which the third flex circuit portion extends such that the upper surface of the flex circuit in the first and fifth flex circuit portions are generally co-planar and generally parallel to the upper surface of the flex circuit in the third flex circuit portion;   at least a first optical/electrical device mounted on the first flex circuit portion on the upper surface of the flex circuit;   at least a second optical/electrical device mounted on the fifth flex circuit portion on the upper surface of the flex circuit; and   at least one electrical connector mounted on the third flex circuit portion on the upper surface of the flex circuit, wherein the upper surface of the flex circuit in the first flex circuit portion is generally parallel to the upper surface of the flex circuit in the third flex circuit portion.   
     
     
         2 . The parallel optical transceiver module of  claim 1 , further comprising:
 a housing in which the folded flex circuit is secured, wherein the first and second optical/electrical devices are contained within the housing.   
     
     
         3 . The parallel optical transceiver module of  claim 1 , further comprising:
 at least first and second heat spreader devices, each heat spreader device having at least first and second heat spreader portions, respectively, the first and second heat spreader portions of the first heat spreader device being in contact with one another at one or more locations on the first and second heat spreader portions of the first heat spreader device, the first and second heat spreader portions of the second heat spreader device being in contact with one another at one or more locations on the first and second heat spreader portions of the second heat spreader device, wherein the first and second heat spreader portions of the first heat spreader device are spaced apart from one another at one or more other locations on the first and second heat spreader portions of the first heat spreader device to provide one or more air gaps in the first heat spreader device that allow air to flow through the first heat spreader device to help move heat away from said at least a first optical/electrical device, and wherein the first and second heat spreader portions of the second heat spreader device are spaced apart from one another at one or more other locations on the first and second heat spreader portions of the second heat spreader device to provide air gaps in the second heat spreader device that allow air to flow through the second heat spreader device to help move heat away from said at least a second optical/electrical device.   
     
     
         4 . The parallel optical transceiver module of  claim 3 , further comprising:
 first and second a stiffener devices, each heat spreader devices having at least a first stiffener portion and a second stiffener portion, wherein the lower surface of the folded flex circuit on the first and fifth flex circuit portions is secured to the first stiffener portions of the first and second stiffener devices, and wherein the lower surface of the folded flex circuit on the third flex circuit portion is secured to the second stiffener portions of the first and second stiffener devices, and wherein the first and second heat spreader portions of the first heat spreader device are secured to the first and second stiffener portions of the first stiffener device, respectively, and wherein the first and second heat spreader portions of the second heat spreader device are spaced apart from one another at one or more other locations on the first and second heat spreader portions of the second heat spreader device such that one or more air gaps exist in the second heat spreader device that allow air to flow through the second heat spreader device to help move heat away from said at least a second optical/electrical device.   
     
     
         5 . The parallel optical transceiver module of  claim 1 , wherein said at least a first optical/electrical device includes at least one laser diode. 
     
     
         6 . The parallel optical transceiver module of  claim 1 , wherein said at least a second optical/electrical device includes at least one photodiode. 
     
     
         7 . A method for assembling an optical transceiver module comprising:
 providing a folded flex circuit having at least upper and lower surfaces and having at least first, second and third flex circuit portions, the flex circuit having a flexible substrate of dielectrically insulating material and a plurality of electrical conductors disposed in or on the substrate, and wherein the first and third flex circuit portions extend generally in respective planes that are generally parallel to each other, wherein at least one optical/electrical device is mounted on the first flex circuit portion on the upper surface of the flex circuit, and wherein at least one electrical connector is mounted on the third flex circuit portion on the upper surface of the flex circuit, wherein the upper surface of the flex circuit in the first flex circuit portion is generally parallel to the upper surface of the flex circuit in the third flex circuit portion.   
     
     
         8 . The method of  claim 7 , further comprising:
 securing the transceiver module in a housing such that the first and second optical/electrical devices are contained within the housing.   
     
     
         9 . A method for assembling an optical transceiver module comprising:
 providing a generally planar flex circuit having at least upper and lower surfaces and having at least first, second and third flex circuit portions, the flex circuit having a flexible substrate of dielectrically insulating material and a plurality of electrical conductors disposed in or on the substrate;   mounting at least one optical/electrical device on the first flex circuit portion on the upper surface of the flex circuit;   mounting at least one electrical connector on the third flex circuit portion on the upper surface of the flex circuit; and   folding the flex circuit such that the upper surface of the flex circuit in the first flex circuit portion is generally parallel to the upper surface of the flex circuit in the third flex circuit portion.   
     
     
         10 . The method of  claim 9 , further comprising:
 securing the folded flex circuit in a housing, wherein said at least one optical/electrical device is contained within the housing.