Stacked die in die bga package

Abstract

Die assemblies may include a first die abutting a substrate comprising a recess adjacent to the substrate. An adhesive element may be contained within the recess to attach the first die to the substrate. A height of the adhesive element may not contribute to an overall height of the die assembly. In some embodiments, a second die comprising a non-rectangular cross-sectional shape may be situated on the first die. Die assemblies ma also comprise a first die on a substrate and comprising a cavity on a side of the first die opposing a side on which the support substrate is located. A second die may be at least partially disposed in the cavity. Die assemblies may also comprise a first die secured to a substrate and partially inserted into a recess of a second die on a side opposing a side on which the substrate is located.

1 . A die assembly, comprising:
 a first die comprising a surface abutting a substrate and recess adjacent to the substrate, wherein the recess extends from the surface into the first die and is defined by at least two sides and an end surface, an edge defining a perimeter of the recess is defined by an intersection of the at least two sides of the recess with the surface of the first die, and the perimeter of the recess does not extend to a perimeter of the first die;   an adhesive element contained within the recess and attaching the first die to the substrate, wherein a height of the adhesive element does not contribute to an overall height of the die assembly; and   a second die situated on the first die, the second die comprising a non-rectangular cross-sectional shape.   
     
     
         2 . A die assembly, comprising:
 a first die mounted to a substrate, the first die comprising a recess extending from a surface of the first die on a side opposing a side on which the substrate is located into the first die, the recess being defined by at least two sides and a bottom surface;   a second die at least partially received within the recess and secured to the first die; and   a third die secured to the second die on a side of the second die opposing a side on which the first die is located, the third die comprising a non-rectangular cross-sectional shape, wherein the third die comprises a recess around an entire periphery of the third die and on a side distal from circuitry of the third die.   
     
     
         3 . A die assembly, comprising:
 a first die mounted to a substrate; and   a second die secured to the first die on a side of the first die opposing a side on which the substrate is located, the second die comprising a larger cross-sectional area than a cross-sectional area of the first die and a cavity defined by at least two opposing sides and a bottom surface, a cross-sectional area of the cavity being smaller than a cross-sectional area of the second die, wherein the first die is at least partially received within the cavity.   
     
     
         4 . The die assembly of  claim 3 , wherein an active surface of the first die faces the substrate. 
     
     
         5 . The die assembly of  claim 4 , wherein an active surface of the second die faces away from the first die. 
     
     
         6 . A die assembly, comprising:
 a first die situated on a support substrate and comprising a cavity extending from a surface on a side of the first die opposing a side on which the support substrate is located into the first die; and   a second die at least partially disposed in the cavity and secured to the first die on a side opposing a side on which the support substrate is located.   
     
     
         7 . The die assembly of  claim 6 , wherein active surfaces of the first and second dice face opposite directions. 
     
     
         8 . A method of fabricating a semiconductor device, comprising:
 disposing an adhesive element in a cavity defined by at least two sides and a bottom surface extending into a first die, wherein a height of the adhesive element does not add to an effective height of the first die;   mounting the first die to a substrate with the cavity facing the substrate; and   securing a second die to the first die on a side of the first die opposing a side on which the substrate is located, wherein the second die comprises a T-shaped cross-sectional shape and a recess defined at a periphery of the second die defines a space between the first die and the second die.   
     
     
         9 . The method of  claim 8 , wherein disposing the adhesive element in the cavity defined by the at least two sides and the bottom comprises disposing the adhesive element in the cavity defined by four sides and the bottom surface. 
     
     
         10 . The method of  claim 8 , wherein securing a second die to the first die comprises securing the second die over the substrate and to the first die, the second die comprising a larger footprint than a footprint of the first die. 
     
     
         11 . The method of  claim 8 , further comprising maintaining the semiconductor device free of a spacer structure between the first and second dice. 
     
     
         12 . A method of fabricating a semiconductor device, comprising:
 disposing an adhesive element in a cavity extending into a first die, wherein a height of the adhesive element does not increase a height of the semiconductor device;   adhering the first die to a substrate using the adhesive element with the cavity facing the substrate;   mounting a second die on a side of the first die opposing a side on which the cavity is located, wherein the second die comprises a non-rectangular cross-sectional shape defining a space between an active surface of the first die and a recessed surface of the second die; and   electrically connecting the first die to the substrate using bond wires extending from the active surface of the first die, beyond the space defined between the first and second dice, to the substrate.   
     
     
         13 . The method of  claim 12 , wherein mounting the second die on the side of the first die comprises mounting the first and second dice with active surfaces of the first and second dice facing the same direction. 
     
     
         14 . The method of  claim 12 , further comprising maintaining the semiconductor device free of a spacer structure between the first and second dice. 
     
     
         15 . The method of  claim 12 , wherein mounting the second die on the first die, wherein the second die comprises a non-rectangular cross-sectional shape comprises mounting the second die on the first die, wherein the second die comprises a T-shaped cross-sectional shape. 
     
     
         16 . A method of fabricating a semiconductor device, comprising:
 mounting a first die on a substrate, wherein the first die comprises a recess extending into the first die on a side of the first die opposing a side on which the substrate is located;   at least partially inserting a second die into the recess and securing the second die to the first die, wherein an active surface of the second die is on a side of the second die opposing a side on which the first die is located;   securing a third die to the active surface of the second die, wherein the third die comprises a non-rectangular cross-sectional shape defining an opening between the second and third dice; and   electrically connecting the second die to the substrate using conductive elements extending from the active surface of the second die, beyond the opening defined between the second and third dice, to the substrate.   
     
     
         17 . The method of  claim 16 , wherein at least partially inserting a second die into the recess comprises leaving at least a portion of the second die to extend beyond the recess. 
     
     
         18 . The method of  claim 16 , wherein securing the third die to the active surface of the second die, wherein the third die comprises the non-rectangular cross-sectional shape, comprises securing the third die to the active surface of the second die, wherein the third die comprises a T-shaped cross-sectional shape. 
     
     
         19 . A method of fabricating a semiconductor device, comprising:
 mounting a first die on a substrate, wherein an active surface of the first die faces the substrate and the first die comprises an inner cavity extending into the first die on a side opposing a side on which the substrate is located;   partially inserting a second die within the inner cavity of the first die with an active surface of the second die facing away from the first die, wherein a portion of the second die extends above the inner cavity; and   securing the second die to the first die.   
     
     
         20 . The method of  claim 19 , further comprising electrically connecting the second die to the substrate using conductive elements extending from the active surface of the second die, beyond a periphery of the first die, to the substrate. 
     
     
         21 . The method of  claim 20 , further comprising mounting a third die to the active surface of the second die, wherein the third die comprises a recessed portion at a periphery of the third die and the conductive elements extend from within the recessed portion to beyond the recessed portion to connect to the substrate. 
     
     
         22 . The method of  claim 21 , further comprising maintaining the semiconductor device free of a spacer structure between the second and third dice. 
     
     
         23 . The method of  claim 21 , wherein footprints of the second and third dice are smaller than a footprint of the first die. 
     
     
         24 . A semiconductor die assembly, comprising:
 a first semiconductor die secured to a substrate with an active surface of the first semiconductor die facing the substrate, the first semiconductor die comprising a first footprint over the substrate; and   a second semiconductor die comprising a recess extending into an inactive surface of the second semiconductor die and secured to the first semiconductor die on a side opposing a side on which the substrate is located wherein the first semiconductor die is partially inserted into the recess of the second semiconductor die and the second semiconductor die comprises a second, larger footprint over the substrate.   
     
     
         25 . The die assembly of  claim 24 , wherein the second semiconductor die comprises a U-shaped cross-sectional shape. 
     
     
         26 . The die assembly of  claim 24 , further comprising an adhesive element located in the recess securing the first semiconductor die to the second semiconductor die. 
     
     
         27 . The die assembly of  claim 24 , wherein the recess is defined by four sides and a bottom surface. 
     
     
         28 . A die assembly, comprising:
 a die situated on and in contact with a substrate, the die comprising a recess defined by at least two opposing sides and a bottom surface extending from an inactive surface of the die into the die and not extending to lateral edges of the die;   an adhesive element contained within the recess of the die securing the die to the substrate, wherein the adhesive element does not add to an overall height of the die assembly.   
     
     
         29 . The die assembly of  claim 28 , further comprising another die secured to the die on a side opposing a side on which the substrate is located, wherein the another die comprises a recessed portion extending along at least lateral edges of the another die to form a space between the die and the another die. 
     
     
         30 . The die assembly of  claim 29 , further comprising conductive elements extending from an active surface of the die within the space between the die and the another die, beyond the space, to the substrate. 
     
     
         31 . The die assembly of  claim 29 , wherein the die assembly is free from spacer structures between the die and the another die. 
     
     
         32 . A die assembly, comprising:
 a die situated on and in contact with a support substrate, the die comprising a perimeter defined by an inactive surface abutting the support substrate extending around the perimeter of the die and a cavity inset in the inactive surface of the die within the perimeter, the cavity defined by four sides and a bottom surface; and   an adhesive element contained within the cavity and securing the die to the support substrate, wherein a height of the adhesive element does not increase an elevation of an active surface of the die as measured from the support substrate.