US2013153948A1PendingUtilityA1

Semiconductor light emitting device and method for manufacturing same

Assignee: TOSHIBA KKPriority: Aug 16, 2007Filed: Feb 13, 2013Published: Jun 20, 2013
Est. expiryAug 16, 2027(~1 yrs left)· nominal 20-yr term from priority
H10H 20/018H10H 20/8316H10H 20/841H10H 20/835H10H 20/856H01L 33/60
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Claims

Abstract

A semiconductor light emitting device includes: a support substrate; a metal layer provided on the support substrate; a semiconductor layer provided on the metal layer and including a light emitting layer; a contact layer containing a semiconductor, selectively provided between the semiconductor layer and the metal layer, and being in contact with the semiconductor layer and the metal layer; and an insulating film provided between the semiconductor layer and the metal layer at a position not overlapping the contact layer.

Claims

exact text as granted — not AI-modified
1 . A semiconductor light emitting device comprising:
 a semiconductor layer having a lower surface and including a light emitting layer;   a contact layer selectively provided in contact with the lower surface;   an insulating film provided in contact with the lower surface so as to surround the contact layer and be spaced apart from the side surfaces of the contact layer;   a transparent material provided between the contact layer and the insulating film, the transparent material in contact with the sides of the insulating and the contact layer and in contact with the lower surface, the transparent material having transparency with respect to the light emitted from the light emitting layer; and   a metal layer provided below and covering the contact layer, the insulating film and the transparent material; and   a support substrate provided below the metal layer.   
     
     
         2 . The semiconductor light emitting device according to  claim 1 , wherein the insulating film is thicker than the contact layer and protrudes toward the metal layer. 
     
     
         3 . The semiconductor light emitting device according to  claim 1 , wherein the width of the transparent material is equal to or less than twice the width of the contact layer. 
     
     
         4 . The semiconductor light emitting device according to  claim 1 , wherein the transparent material contains ITO. 
     
     
         5 . The semiconductor light emitting device according to  claim 1 , wherein an interface between the transparent material and the metal layer has higher reflectance with respect to the light emitted from the light emitting layer than an interface between the contact layer and the semiconductor layer.

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