High-strength copper alloy plate excellent in oxide film adhesiveness

Abstract

The present invention is a Cu—Fe—P system copper alloy plate comprising Fe: 0.02-0.5% and P: 0.01-0.25% in mass % with the balance consisting of copper and unavoidable impurities and having the ratio Fe/P of Fe to P in mass % being 2.0 to 5.0, wherein: a ratio of the area of fine crystal grains less than 0.5 μm in equivalent circle diameter to an observation area when a surface is observed by EBSD analysis is 0.90 or less; and the ratio C1s/Cu2p of a peak area of C1s to a peak area of Cu2p on the surface by XPS analysis is 0.35 or less.

What is claimed is: 
     
         1 . A high-strength copper alloy plate excellent in oxide film adhesiveness, the copper alloy plate comprising Fe: 0.02-0.5% and P: 0.01-0.25% in mass % with the balance consisting of copper and unavoidable impurities and having the ratio Fe/P of Fe to P in mass % being 2.0 to 5.0, wherein: a ratio of the area of fine crystal grains less than 0.5 μm in equivalent circle diameter to an observation area when a surface is observed by electron backscatter diffraction analysis is 0.90 or less; and the ratio C1s/Cu2p of a peak area of C1s to a peak area of Cu2p on the surface by XPS analysis is 0.35 or less. 
     
     
         2 . The high-strength copper alloy plate excellent in oxide film adhesiveness according to  claim 1 , the copper alloy plate further comprising Sn: 0.005-3% in mass %. 
     
     
         3 . The high-strength copper alloy plate excellent in oxide film adhesiveness according to  claim 1  or  2 , the copper alloy plate further comprising Zn: 0.005-3% in mass %. 
     
     
         4 . The high-strength copper alloy plate excellent in oxide film adhesiveness according to any one of  claims 1  to  3 , wherein: a tensile strength in the longitudinal direction of the copper alloy plate is 500 MPa or more; and a percentage elongation after fracture in the longitudinal direction is 5% or more. 
     
     
         5 . The high-strength copper alloy plate excellent in oxide film adhesiveness according to  claim 1 , wherein the XPS analysis is carried out after alkali cathode electrolytic cleaning is applied. 
     
     
         6 . The high-strength copper alloy plate excellent in oxide film adhesiveness according to  claim 5 , the copper alloy plate further comprising Sn: 0.005-3% in mass %. 
     
     
         7 . The high-strength copper alloy plate excellent in oxide film adhesiveness according to  claim 5  or  6 , the copper alloy plate further comprising Zn: 0.005-3% in mass %. 
     
     
         8 . The high-strength copper alloy plate excellent in oxide film adhesiveness according to any one of  claims 5  to  7 , wherein: a tensile strength in the longitudinal direction of the copper alloy plate is 500 MPa or more; and a percentage elongation after fracture in the longitudinal direction is 5% or more.