Heat sink

Abstract

Disclosed herein is a heat sink including: a pipe for refrigerant movement including a first path, a third path having a cross-sectional area smaller than that of the first path in a thickness direction, and a second path connecting between the first and third paths and having a cross-sectional area in the thickness direction reduced from the first path toward the third path; and a case enclosing the pipe for refrigerant movement.

What is claimed is: 
     
         1 . A heat sink comprising:
 a pipe for refrigerant movement including a first path, a third path having a cross-sectional area smaller than that of the first path in a thickness direction, and a second path connecting between the first and third paths and having a cross-sectional area in the thickness direction reduced from the first path toward the third path; and   a case enclosing the pipe for refrigerant movement.   
     
     
         2 . The heat sink as set forth in  claim 1 , wherein the number of each of the first paths, the second paths, and the third paths is plural. 
     
     
         3 . The heat sink as set forth in  claim 2 , wherein the first and third paths are alternately arranged. 
     
     
         4 . The heat sink as set forth in  claim 1 , wherein the number of pipes for refrigerant movement is plural. 
     
     
         5 . The heat sink as set forth in  claim 4 , wherein the plurality of pipes for refrigerant movement are arranged in the thickness direction. 
     
     
         6 . The heat sink as set forth in  claim 1 , wherein a cross-sectional area of the pipe for refrigerant movement is in proportion to a change in width of the pipe for refrigerant movement in the thickness direction. 
     
     
         7 . The heat sink as set forth in  claim 1 , wherein a cross-sectional area of the pipe for refrigerant movement is in proportion to a change in height of the pipe for refrigerant movement in the thickness direction. 
     
     
         8 . The heat sink as set forth in  claim 1 , wherein each of one surfaces and the other surfaces of the second and third paths of the pipe for refrigerant movement contacts inner side surfaces of the case. 
     
     
         9 . The heat sink as set forth in  claim 8 , wherein a semiconductor chip is attached onto the case and is attached onto the case at a region at which the case contacts the third path. 
     
     
         10 . The heat sink as set forth in  claim 1 , wherein at least one of one surfaces and the other surfaces of the second and third paths of the pipe for refrigerant movement contacts inner side surfaces of the case and the other thereof is spaced apart from the inner side surface of the case. 
     
     
         11 . The heat sink as set forth in  claim 10 , wherein a semiconductor chip is attached onto the case and is attached onto the case at a region at which the case contacts the third path. 
     
     
         12 . The heat sink as set forth in  claim 1 , wherein each of both distal ends of the case in a length direction is provided with a refrigerant inlet through which the refrigerant is introduced to the pipe for refrigerant movement and a refrigerant outlet through which the refrigerant is discharged from the pipe for refrigerant movement. 
     
     
         13 . The heat sink as set forth in  claim 1 , further comprising a pin formed in the third path. 
     
     
         14 . The heat sink as set forth in  claim 13 , wherein the number of pins is plural. 
     
     
         15 . The heat sink as set forth in  claim 13 , wherein the pin has a plate shape. 
     
     
         16 . The heat sink as set forth in  claim 15 , wherein the pin is formed so that one surface and the other surface thereof are in parallel with a direction in which the refrigerant flows. 
     
     
         17 . A heat sink comprising:
 a pipe for refrigerant movement including a first path, a third path having a cross-sectional area smaller than that of the first path in a thickness direction, and a second path connecting between the first and third paths and having a cross-sectional area in the thickness direction reduced from the first path toward the third path; and   a case enclosing the pipe for refrigerant movement,   wherein a cross-sectional area of the pipe for refrigerant movement is in proportion to changes in width and height of the pipe for refrigerant movement in the thickness direction.   
     
     
         18 . The heat sink as set forth in  claim 17 , further comprising a pin formed in the third path. 
     
     
         19 . The heat sink as set forth in  claim 18 , wherein the number of pins is plural. 
     
     
         20 . The heat sink as set forth in  claim 18 , wherein the pin has a plate shape, and
 the pin is formed so that one surface and the other surface thereof are in parallel with a direction in which the refrigerant flows.