US2013140007A1PendingUtilityA1

Components with re-entrant shaped cooling channels and methods of manufacture

Assignee: GEN ELECTRICPriority: Nov 10, 2010Filed: Jan 30, 2013Published: Jun 6, 2013
Est. expiryNov 10, 2030(~4.3 yrs left)· nominal 20-yr term from priority
B23P 15/04F05D 2230/10C23C 4/04Y10T29/49341B23P 2700/13C23C 4/02C23C 4/134F01D 5/187Y10T29/49339Y02T50/60B24C 1/04C23C 14/32F28F 13/18C23C 4/12C23C 14/16
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Claims

Abstract

A method of fabricating a component is provided. The method includes forming one or more grooves in a surface of a substrate, where the substrate has at least one hollow interior space. Each of the one or more grooves extends at least partially along the substrate surface and has a base and a top. The base is wider than the top, such that each of the one or more grooves comprises a re-entrant shaped groove. The method further includes forming one or more access holes through the base of a respective groove, to connect the groove in fluid communication with respective ones of the hollow interior space(s), and disposing a coating over at least a portion of the substrate surface. The one or more grooves and coating define one or more re-entrant shaped channels for cooling the component. A component with one or more re-entrant shaped channels and a method of coating a component are also provided.

Claims

exact text as granted — not AI-modified
1 . A component comprising
 a substrate comprising an outer surface and an inner surface, wherein the inner surface defines at least one hollow, interior space, wherein the outer surface defines one or more grooves, wherein each of the one or more grooves extends at least partially along the surface of the substrate and has a base and a top, wherein the base is wider than the top such that each of the one or more grooves comprises a re-entrant shaped groove, wherein one or more access holes is formed through the base of a respective one of the one or more grooves, to connect respective ones of the one or more grooves in fluid communication with respective ones of the at least one hollow interior space; and   at least one coating disposed over at least a portion of the surface of the substrate, wherein the one or more grooves and the coating define one or more re-entrant shaped channels for cooling the component.   
     
     
         2 . The component of  claim 1 , wherein the coating comprises at least one of a metal coating, a bond coating, and a thermal barrier coating. 
     
     
         3 . The component of  claim 1 , wherein the base of a respective one of the one or more re-entrant shaped grooves is at least 2 times wider than the top of the respective groove. 
     
     
         4 . The component of  claim 3 , wherein the base of the respective re-entrant shaped groove is in a range of about 3-4 times wider than the top of the respective groove. 
     
     
         5 . The component of  claim 1 , wherein a wall of a respective one of the one or more re-entrant shaped grooves is oriented at an angle φ in a range of about 10-89 degrees relative to a surface normal. 
     
     
         6 . The component of  claim 5 , wherein the wall of the respective one of the one or more re-entrant shaped grooves is oriented at an angle φ in a range of about 20-45 degrees relative to a surface normal. 
     
     
         7 . The component of  claim 1 , wherein the coating completely bridges the respective one or more grooves such that the coating seals the respective one or more channels. 
     
     
         8 . The component of  claim 1 , wherein the coating defines one or more porous gaps such that the coating does not completely bridge each of the respective one or more grooves. 
     
     
         9 . A method of coating a component without the use of a sacrificial filler, the method comprising:
 forming one or more grooves in a surface of a substrate, wherein the substrate has at least one hollow interior space, wherein each of the one or more grooves extends at least partially along the surface of the substrate and has a base and a top, wherein the top is about 0.1 mm to 0.5 mm in width; and   disposing a coating over at least a portion of the surface of the substrate directly over open ones of the one or more grooves, wherein the one or more grooves and the coating define one or more channels for cooling the component.   
     
     
         10 . The method of  claim 9 , further comprising:
 casting the substrate prior to forming the one or more grooves in the surface of the substrate; and   forming one or more access holes through the base of a respective one of the one or more grooves, to connect the groove in fluid communication with respective ones of the at least one hollow interior space,   
       wherein the coating comprises at least one of a metal coating, a bond coating, and a thermal barrier coating. 
     
     
         11 . The method of  claim 9 , wherein disposing a coating over at least the portion of the surface of the substrate comprises performing at least one of:
 an ion plasma deposition,   a high velocity oxygen fuel spray (HVOF) process,   a high velocity air fuel spray (HVAF) process, or   a low pressure plasma spray (LPPS) process.   
     
     
         12 . The method of  claim 9 , wherein the coating completely bridges the respective one or more grooves, such that the coating seals the respective one or more channels. 
     
     
         13 . The method of  claim 9 , wherein the coating defines one or more porous gaps, such that the coating does not completely bridge each of the respective one or more grooves.

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