Cooling system, electronic equipment, and method for cooling heating element

Abstract

A cooling system includes a first cooling part to cool a connecting part of a heating element with a first coolant having an electrical insulating property, the connecting part providing electrical connection between the heating element and a board, and a second cooling part to cool another part of the heating element with a second coolant, said other part being different from the connecting part.

What is claimed is: 
     
         1 . A cooling system comprising:
 a first cooling part to cool a connecting part of a heating element with a first coolant having an electrical insulating property, the connecting part providing electrical connection between the heating element and a board; and   a second cooling part to cool another part of the heating element with a second coolant, said other part being different from the connecting part.   
     
     
         2 . The cooling system according to  claim 1 , wherein the first cooling part is configured to immerse the connecting part of the heating element in the first coolant, and the second cooling part is configured to supply the second coolant to said other part of the heating element. 
     
     
         3 . The cooling system according to  claim 2 , further comprising:
 a casing to accommodate the first coolant and the second coolant,   wherein a specific gravity of the first coolant is greater than a specific gravity of the second coolant, and   wherein the second cooling part has a first supply unit to supply the second coolant taken out of the casing to said other part of the heating element.   
     
     
         4 . The cooling system according to  claim 3 , further comprising:
 a circulator to circulate the second coolant that has absorbed heat from the heating element; and   a heat release part provided on a path of the circulator to remove the heat from the second coolant,   wherein the circulator supplies the heat-removed second coolant to the first supply unit.   
     
     
         5 . The cooling system according to  claim 1 , wherein
 the first cooling part is configured to supply the first coolant to the connecting part of the heating element; and   the second cooling part is configured to supply the second coolant to said other part of the heating element.   
     
     
         6 . The cooling system according to  claim 5 , further comprising:
 a tank to accommodate the first coolant and the second coolant,   wherein a specific gravity of the first coolant is greater than a specific gravity of the second coolant, and   wherein the first cooling part has a second supply unit to supply the first coolant from the tank to the connecting part of the heating element, and the second cooling part has a third supply unit to supply the second coolant from the tank to said other part of the heating element.   
     
     
         7 . The cooling system according to  claim 6 , wherein the second supply unit forms a curtain flow of the first coolant to surround the connecting part. 
     
     
         8 . The cooling system according to  claim 6 , further comprising:
 a first pipe to supply the first coolant and the second coolant having been supplied to the heating element to the tank;   a second pipe to supply the first coolant from the tank to the second supply unit; and   a third pipe to supply the second coolant from the tank to the third supply unit.   
     
     
         9 . The cooling system according  claim 1 , wherein the first coolant includes one of fluorocarbon, halogenated hydrocarbon, and dielectric oil. 
     
     
         10 . The cooling system according to  claim 1 , wherein the second coolant contains water or pure water as a major ingredient. 
     
     
         11 . Electronic equipment, comprising:
 a semiconductor device having a connecting part for connecting the semiconductor device to a board;   a first cooling part to cool the connecting part of the semiconductor device with a first coolant having an insulating property; and   a second cooling part to cool another part of the semiconductor device with a second coolant, said other part being different from the connecting part.   
     
     
         12 . The electronic equipment according to  claim 11 , wherein the first cooling part is configured to immerse the connecting part of the semiconductor device in the first coolant, and the second cooling part is configured to supply the second coolant to said other part of the semiconductor device. 
     
     
         13 . The electronic equipment according to  claim 12 , further comprising:
 a casing to accommodate the first coolant and the second coolant,   wherein a specific gravity of the first coolant is greater than that of the second coolant, and   wherein the second cooling part include a first supply unit to supply the second coolant taken out of the casing to said other part of the semiconductor device.   
     
     
         14 . The electronic equipment according to  claim 13 , further comprising:
 a circulator to circulate the second coolant that has cooled the semiconductor device; and   a heat radiator provided on the circulator and to remove heat from the second coolant,   wherein the circulator supplies the heat-removed second coolant to the first supply unit.   
     
     
         15 . The electronic equipment according to  claim 11 ,
 wherein the first cooling part is configured to supply the first coolant to the connecting part of the semiconductor device, and the second cooling part is configured to supply the second coolant to said other part of the semiconductor device.   
     
     
         16 . The electronic equipment according to  claim 15 , further comprising:
 a tank to accommodate the first coolant and the second coolant having been supplied to the semiconductor device,   wherein a specific gravity of the first coolant is greater than that of the second coolant,   wherein the first cooling part has a second supply unit to supply the first coolant taken out of the tank to the connecting part of the semiconductor device, and   wherein the second cooling part has a third supply unit to supply the second coolant taken out of the tank to said other part of the semiconductor device.   
     
     
         17 . The electronic equipment according to  claim 16 , wherein the second supply unit forms a curtain flow of the first coolant to surround the connecting part of the semiconductor device. 
     
     
         18 . The electronic equipment according to  claim 16 , further comprising:
 a first pipe to supply the first coolant and the second coolant having been supplied to the semiconductor device to the tank;   a second pipe to supply the first coolant from the tank to the second supply unit; and   a third pipe to supply the second coolant from the tank to the third supply unit.   
     
     
         19 . The electronic equipment according to  claim 11 , wherein the first coolant one of fluorocarbon, halogenated hydrocarbon, and dielectric oil. 
     
     
         20 . A method for cooling a heating element comprising:
 cooling a connecting part of a heating element with a first coolant having an electrical insulating property; and   cooling another part of the heating element with a second coolant, said other part being different from the connecting part.