Chip assembly for use in a microfluidic analysis sytem

Abstract

A chip assembly for use in a microfluidic analysis system, such as a patch clamp apparatus, comprises a chip having an outer wall, a carrier structure comprising an aperture for receiving the chip, the aperture defining an inner wall, wherein the chip is arranged in the aperture with a liquid tight seal between the outer wall of the chip and the inner wall of the aperture. The chip may be sealed and bonded to the carrier structure by means of a bonding material, such as an UV curing adhesive. A through hole in the chip is aligned with the aperture in the carrier structure. A method for manufacturing the chip assembly is further disclosed.

1 . A chip assembly for use in a microfluidic analysis system, comprising:
 a chip having an outer wall,   a carrier structure comprising an aperture defining an inner wall;   wherein the chip is secured to the carrier structure with a liquid tight seal between the chip and the carrier structure, and wherein a hole is formed in the chip, the hole being arranged essentially coaxially with the aperture in the carrier structure.   
     
     
         2 . The chip assembly according to  claim 1 , wherein the chip has an outer diameter, which is smaller than the diameter of the aperture, and wherein a gap between the chip and the carrier structure is sealed with a bonding material, which bonds the chip to the carrier structure. 
     
     
         3 . The chip assembly according to  claim 2 , wherein the gap communicates with a dispensing well in the carrier structure, which is filled with said bonding material. 
     
     
         4 . The chip assembly according to  claim 2 , wherein the bonding material is selected from the group consisting of: a hotmelt glue, an acrylic UV curable adhesive, an epoxy-based UV curable adhesive, a one-component thermosetting epoxy-based adhesive, and a two-component thermosetting epoxy-based adhesive. 
     
     
         5 . The chip assembly according to  claim 2 , wherein the bonding material has a viscosity at room temperature and/or at the dispensing temperature between 1 and 200000 mPa s, such as between 5 and 100000 mPa s, such as between 10000 and 100000 mPa s, such as between 35000 and 75000 mPa s, such as between 40000 and 60000 mPa s, or a viscosity at room temperature and/or at the dispensing temperature between 10 and 1000 mPA s, such as between 50 and 500 mPa s. 
     
     
         6 . The chip assembly according to  claim 2 , wherein the bonding material forms a contact angle with the carrier structure of less than 90 degrees in atmospheric air. 
     
     
         7 . The chip assembly according to  claim 1 , wherein the chip is press fitted into the carrier structure. 
     
     
         8 . The chip assembly according to  claim 1 , comprising an array of a plurality of chips received in respective apertures in the carrier structure. 
     
     
         9 . The chip assembly according to  claim 1 , wherein the chip has a diameter of 0.1-2 mm. 
     
     
         10 . The chip assembly according to  claim 1 , wherein each of the upper and lower surfaces of the chip has an area of at most 5 mm 2 . 
     
     
         11 . A method of manufacturing a chip assembly for use in a microfluidic analysis system, comprising:
 a chip having an outer wall, with a hole being provided in the chip;   a carrier structure comprising an aperture defming an inner wall; the method comprising the steps of   securing the chip to the carrier structure with the hole arranged essentially coaxially with the aperture in the carrier structure; and   forming a liquid tight seal between the chip and the carrier structure.   
     
     
         12 . The method according to  claim 11 , wherein the chip has an outer diameter, which is smaller than the diameter of the aperture, and wherein the method comprises filling and sealing a gap between the chip and the carrier structure with a bonding material. 
     
     
         13 . The method according to  claim 11 , wherein the gap communicates with a dispensing well in the carrier structure, and wherein the step of filling the gap with the bonding material comprises the step of filling the bonding material into the dispensing well and causing the bonding material to flow into the gap under the action of capillary forces. 
     
     
         14 . The method according to  claim 12 , comprising the steps of:
 attaching a tape to one side of the carrier structure prior to filling said gap with the bonding material;   removing the tape after the gap has been filled with the bonding material.   
     
     
         15 . A method according to  claim 14 , wherein:
 an adhesive surface of the tape faces the carrier structure when the tape is attached thereto; and wherein   the bonding material is cured by UV irradiation after having being filled into said gap; and wherein   the adhesive of the tape detaches from the carrier structure upon exposure to UV light.   
     
     
         16 . The method according to  claim 11 , comprising the step of moulding the bonding material into the aperture in the carrier structure and subsequently press-fitting the chip into the carrier structure.