US2013134361A1PendingUtilityA1
Graphene ball structure and method of manufacturing the same
Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Nov 25, 2011Filed: Nov 20, 2012Published: May 30, 2013
Est. expiryNov 25, 2031(~5.3 yrs left)· nominal 20-yr term from priority
C01B 32/194B82Y 40/00C01B 32/186H01B 1/04B82Y 30/00Y10S977/734Y10S977/773
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Claims
Abstract
A graphene dot structure and a method of manufacturing the same. The graphene dot structure includes a core including a semiconductor material; and a graphene shell formed on the surface of the core. The graphene dot structure may form a network.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A graphene dot structure comprising:
a core comprising a semiconductor material; and a shell formed on the surface of the core, said shell comprising graphene.
2 . The graphene dot structure of claim 1 , wherein the semiconductor material comprises a IV group semiconductor, a III-V group semiconductor, or a II-VI group semiconductor.
3 . The graphene dot structure of claim 1 , wherein the core has an average size in the range of about 1 nm to about 10 μm.
4 . The graphene dot structure of claim 1 , wherein the graphene shell has one or more layers.
5 . The graphene dot structure of claim 1 , wherein the core comprises:
a first core; and a second core formed on the surface of the first core and comprising the semiconductor material.
6 . The graphene dot structure of claim 5 , wherein the first core comprises an non-conductive material or a metal.
7 . A network structure comprising a plurality of the graphene dot structures as described in claim 1 .
8 . A method of manufacturing a graphene structure, the method comprising:
providing a gas including a semiconductor material and a gas including carbon into a reaction chamber; and performing chemical vapor deposition to form a core of the semiconductor material and a shell of graphene on the surface of the core.
9 . The method of claim 8 , wherein the semiconductor material comprises a IV group semiconductor, a III-V group semiconductor, or a II-VI group semiconductor.
10 . The method of claim 8 , wherein the core is formed to have a diameter in the range of about 1 nm to about 10 μm.
11 . The method of claim 8 , wherein the graphene shell is formed to have one or more layers.
12 . The method of claim 8 , wherein the reaction chamber comprises a non-conductive material or a metal, and the semiconductor material is deposited onto the non-conductive material or the metal.
13 . The method of claim 8 , further comprising removing the core from the structure of the semiconductor core and the graphene shell.
14 . The method of claim 13 , wherein the removing comprises wet etching the semiconductor core.
15 . The method of claim 13 , wherein the removing comprises vaporizing the semiconductor core at a temperature and a pressure allowing the vaporization of the semiconductor core.
16 . The method of claim 8 , wherein the gas including the semiconductor material comprises GeH 4 gas and the gas including the carbon comprises CH 4 gas.
17 . The method of claim 8 , wherein the temperature of the reaction chamber is maintained in the range of about 200° C. to about 900° C.
18 . The method of claim 8 , wherein the pressure of the reaction chamber is maintained in the range of about 0.1 Torr to about 300 Torr.
19 . The method of claim 8 , further comprises forming a network of a plurality of the formed structures of the semiconductor core and the graphene shell.Join the waitlist — get patent alerts
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