Method for measuring three-dimension shape of target object

Abstract

A method of measuring a 3D shape, which can measure a 3D shape of target objects on a board by searching a database for bare board information when a measuring object is not set to a normal inspection mode or by performing bare board teaching when the board is supplied from a supplier having not the bare board information is provided. The method of measuring a 3D shape includes operation S 100 of measuring a brightness of a first illumination source 41 a , operation S 200 of measuring a phase-to-height conversion factor, operation S 300 of determining whether the measurement is performed in a normal inspection mode, operation S 400 of measuring a 3D shape of a board 62 according to the normal inspection mode, operation S 500 of determining whether bare board information about the board 62 is included, operation S 600 of performing bare board teaching when the bare board information is excluded, operation S 700 of measuring the 3D shape of target objects on the board 62 when the bare board information is included or bare board teaching information is generated, and operation S 800 of analyzing whether the board 62 is normal or abnormal by using 3D shape information. Therefore, the 3D shape of target objects on the board may be more readily measured.

What is claimed is: 
     
         1 . A method of measuring a three-dimensional shape, comprising:
 transferring a target object having a conductive pad on which a solder is not formed by controlling a table transfer device;   illuminating a pattern light onto the target object having the conductive pad on which a solder is not formed;   acquiring a pattern image of the pattern light illuminated onto the target object having the conductive pad on which a solder is not formed;   calculating height of the conductive pad by using the acquired pattern image;   transferring a target object having a conductive pad on which a solder is formed by controlling the table transfer device;   illuminating a pattern light onto the target object having the conductive pad on which the solder is formed;   acquiring a pattern image of the pattern light illuminated onto the target object having the conductive pad on which the solder is formed;   calculating a height of the solder by using the acquired pattern image;   calculating a height of the solder in which the height of the pad is excluded; and   calculating a volume, a height distribution and a center of gravity of the solder.   
     
     
         2 . The method of  claim 1 , wherein calculating a height of the solder by using the acquired pattern image comprises:
 calculating a histogram by using the acquired pattern image;   calculating a reference plane by using the calculated histogram; and   calculating the height of the solder that is relative to the reference plane.   
     
     
         3 . The method of  claim 1 , wherein illuminating a pattern light onto the target object having the conductive pad on which a solder is not formed and illuminating a pattern light onto the target object having the conductive pad on which the solder is formed comprises switching off any one of a plurality of first illumination sources and switching on a remaining first illumination source. 
     
     
         4 . The method of  claim 3 , wherein calculating a height of the solder by using the acquired pattern image comprises unifying heights respectively measured by the first illumination sources. 
     
     
         5 . The method of  claim 1 , further comprising:
 illuminating a second illumination source onto the target object and capturing an image thereof;   acquiring a particular shape from the captured image; and   searching a database for a target object information having a shape that is substantially identical to the acquired particular shape.   
     
     
         6 . The method of  claim 1 , wherein calculating a volume, a height distribution and a center of gravity of the solder comprises calculating an eccentricity for judging whether the solder is separated from the conductive pad by using the center of gravity. 
     
     
         7 . A method of measuring a three-dimensional shape, comprising:
 illuminating a pattern light generated from an illumination source onto a target object including a conductive pad and a solder;   acquiring a pattern image of the pattern light by a camera; and   calculating a volume, a height distribution and a center of gravity of the solder by using the acquired pattern image.   
     
     
         8 . The method of  claim 7 , wherein calculating a volume, a height distribution and a center of gravity of the solder by using the acquired pattern image comprises calculating an eccentricity for judging whether the solder is separated from a center of the conductive pad by using the center of gravity.