Light emitting diode package structure

Abstract

A light emitting diode package structure includes a substrate, LED bare chips and a lens. The substrate has an upper surface, a lower surface and a side surface between the upper surface and the lower surface. The upper surface is provided with a circuit pattern. The side surface is provided with a groove. The LED bare chips are fixed on the upper surface and electrically connected with the circuit pattern. The lens covers the LED bare chips, the upper surface and the circuit pattern by an injection molding process so as to be inserted into the groove. With this arrangement, the connecting strength between the substrate and the lens can be enhanced, thereby achieving waterproof and anti-electrostatic effects. Further, material cost of the present invention is reduced greatly.

What is claimed is: 
     
         1 . A light emitting diode package structure, including:
 a substrate ( 10 ) having an upper surface ( 11 ), a lower surface ( 12 ) and a side surface ( 13 ) between the upper surface ( 11 ) and the lower surface ( 12 ), the upper surface ( 11 ) being provided with a circuit pattern ( 111 ), and the side surface ( 13 ) being provided with a flange ( 14 );   a plurality of LED bare chips ( 20 ) fixed on the upper surface ( 11 ) and electrically connected with the circuit pattern ( 111 ); and   a lens ( 30 ) covering the LED bare chips ( 20 ), the upper surface ( 11 ) and the circuit pattern ( 111 ) by means of an injection molding process so as to be engaged with the flange ( 14 ).   
     
     
         2 . The light emitting diode package structure according to  claim 1 , wherein the substrate ( 10 ) is a metallic substrate. 
     
     
         3 . The light emitting diode package structure according to  claim 2 , wherein the circuit pattern ( 111 ) is combined on the upper surface ( 11 ) of the metallic substrate ( 10 ) in an electrical insulating manner. 
     
     
         4 . The light emitting diode package structure according to  claim 2 , wherein a first and a last ends of the circuit pattern ( 111 ) are formed with an electrical conducting contact ( 112 ) respectively. 
     
     
         5 . The light emitting diode package structure according to  claim 2 , wherein the flange ( 14 ) is an annular flange surrounding a profile of the substrate ( 10 ). 
     
     
         6 . The light emitting diode package structure according to  claim 1 , wherein a solid light-guiding post ( 31 ) is formed in the lens ( 30 ) above a corresponding LED bare chip ( 20 ), and the light-guiding post ( 31 ) is formed into a conical shape. 
     
     
         7 . The Light emitting diode package structure according to  claim 6 , wherein a top of the light-guiding post ( 31 ) is formed into a light-converging protrusion ( 311 ), and a periphery of the light-guiding posts ( 31 ) is formed with an annular frame ( 32 ).