Packaging for Low-Cost, High-Performance Microwave and Millimeter Wave Modules

Abstract

Microwave or millimeter wave module packaging having a module with a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a first side thereof and operatively connected to the components, and a second connector attached to a second side thereof and operatively connected to the components through the board. The cover and baseplate form a cavity containing the board and components, and the second connector may be operatively connected to a third connector such as a printed circuit board disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operatively connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.

1 . A method for eliminating feed-throughs in an assembly comprising the steps of:
 providing a structure having an indentation for accepting a module, said indentation bounded on one side by a printed circuit board;   operatively connecting a module to the printed circuit board, the module comprising:
 a baseplate having a microwave or millimeter wave component attached thereto; 
 a substantially planar transition board having a first connector attached to a first side of said board and operatively connected to said component, and a second connector attached to a second side of said board and operatively connected to said component through said board, said connectors providing a direct connection without a wire or cable; and 
 a first cover wherein said first cover and said baseplate form a cavity containing said board and said component; and 
   removably attaching a second cover to the structure to enclose the module, wherein power and signal connectors to the module are not attached to either the baseplate or the cover.   
     
     
         2 . The method of  claim 1 , wherein the component is selected from the group consisting of: monolithic microwave integrated circuit chips, field effect transistors, transistors, diodes, mixers, multipliers, modulators, amplifiers, attenuators, switches, circulators, isolators, filters, couplers, detectors, splitters, combiners, substrates, or combinations thereof. 
     
     
         3 . The method of  claim 1 , wherein connection between said second connector and said printed circuit board is a blind mate connection. 
     
     
         4 . The method of  claim 1 , wherein the step of removably attaching a second cover further comprises providing electromagnetic Interference protection. 
     
     
         5 . The method of  claim 1 , wherein the step of operatively connecting a module to the printed circuit board further comprises transferring heat generated from the component to the structure.