Thermal interface material application for integrated circuit cooling

Abstract

Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board.

What is claimed is: 
     
         1 . A method, comprising:
 forming at least one thermal interface material application via in a printed circuit board;   mounting an integrated circuit module on the printed circuit board, the integrated circuit module being mounted on a first surface of the printed circuit board in alignment with the at least one thermal interface material application via formed therein;   mounting a heat transfer device on a second surface of the printed circuit board in alignment with the at least one thermal interface material application via formed therein, the second surface of the printed circuit board being opposite to the first surface of the printed circuit board.   
     
     
         2 . The method of  claim 1 , further comprising applying a thermal interface material through the at least one thermal interface material application via formed in the printed circuit board prior to mounting the heat transfer device on a second surface of the printed circuit board. 
     
     
         3 . The method of  claim 2 , wherein the thermal interface material is applied through the at least one thermal interface material application by injecting the thermal interface material through the at least one thermal interface material application via. 
     
     
         4 . The method of  claim 2 , wherein the thermal interface material is applied through the at least one thermal interface material application via formed in the printed circuit board after one or more components are surface-mounted on the printed circuit board. 
     
     
         5 . The method of  claim 4 , wherein the one or more components are surface-mounted on the printed circuit board via a reflow soldering process. 
     
     
         6 . A method, comprising:
 forming at least one non-plated through via in a printed circuit board;   mounting an integrated circuit module on the printed circuit board, the integrated circuit module being mounted on a first surface of the printed circuit board in alignment with the at least one non-plated through via formed therein;   mounting one or more components on the printed circuit board via a reflow soldering process;   injecting a thermal interface material through the at least one non-plated through via; and   mounting a heat transfer device on a second surface of the printed circuit board in alignment with the at least one non-plated through via formed therein, the second surface of the printed circuit board being opposite to the first surface of the printed circuit board.