Heat dissipating device and manufacture method thereof

Abstract

A heat dissipating device includes a base and a plurality of heat dissipating layers. The base has a first surface and a second surface which are opposite to each other. The heat dissipating layers are formed on the first surface of the base in sequence. Each heat dissipating layer has at least one heat dissipating structure, which includes a heat storage/dissipation area and a heat conductive area. The heat storage/dissipation area surrounds the heat conductive area, and a gap is configured between the heat storage/dissipation area and the heat conductive area. The heat storage/dissipation areas of two adjacent heat dissipating layers contact with each other, while the heat conductive areas of two adjacent heat dissipating layers contact with each other.

What is claimed is: 
     
         1 . A heat dissipating device, comprising:
 a base having a first surface and a second surface opposite to each other; and   a plurality of heat dissipating layers formed on the first surface of the base in sequence;   wherein, each of the heat dissipating layers has at least one heat dissipating structure, the heat dissipating structure comprises a heat storage/dissipation area and a heat conductive area, the heat storage/dissipation area surrounds the heat conductive area, a gap is configured between the heat storage/dissipation area and the heat conductive area, and the heat storage/dissipation areas of adjacent two of the heat dissipating layers contact with each other, while the heat conductive areas of adjacent two of the heat dissipating layers contact with each other.   
     
     
         2 . The heat dissipating device of  claim 1 , wherein the base is made of a metal comprising copper, aluminum, gold, silver, tungsten, or their alloys. 
     
     
         3 . The heat dissipating device of  claim 1 , wherein the thickness of the base is between 100 μm and 1000 μm. 
     
     
         4 . The heat dissipating device of  claim 1 , wherein the heat storage-dissipation area comprises a plurality of non-metal particles. 
     
     
         5 . The heat dissipating device of  claim 4 , wherein the non-metal particles are graphite particles, the purity of the graphite particle is between 97% and 99.9%, and the diameter of the graphite particle is between 500 μm and 3000 μm. 
     
     
         6 . The heat dissipating device of  claim 1 , wherein the heat conductive area comprises a plurality of metal particles. 
     
     
         7 . The heat dissipating device of  claim 6 , wherein the metal particles comprises copper, aluminum, gold, silver, tungsten, or their alloys. 
     
     
         8 . The heat dissipating device of  claim 1 , wherein the ratio of the size of the heat conductive area to the size of the heat storage/dissipation area is between 1:1.25 and 1:2.5. 
     
     
         9 . The heat dissipating device of  claim 1 , further comprising:
 an adhesive layer formed on the second surface of the base; and   a protection layer formed on the heat dissipating layers.   
     
     
         10 . The heat dissipating device of  claim 1 , wherein the ratio of the gap to the circumference of the heat storage/dissipation area is between 0.01:1 and 0.15:1. 
     
     
         11 . A manufacturing method of a heat dissipating device, comprising steps of:
 providing a base; and   printing a plurality of heat dissipating layers on a first surface of the base in sequence;   wherein each of the heat dissipating layers has at least one heat dissipating structure, the heat dissipating structure comprises a heat storage/dissipation area and a heat conductive area, the heat storage/dissipation area surrounds the heat conductive area, a gap is configured between the heat storage/dissipation area and the heat conductive area, and the heat storage/dissipation areas of adjacent two of the heat dissipating layers contact with each other, while the heat conductive areas of adjacent two of the heat dissipating layers contact with each other.   
     
     
         12 . The manufacturing method of  claim 11 , wherein the heat dissipating layers are formed on the first surface of the base by screen printing using multiple printing method or overprinting method. 
     
     
         13 . The manufacturing method of  claim 11 , further comprising steps of:
 forming an adhesive layer on the second surface of the base; and   forming a protection layer on the heat dissipating layers.