Epoxy resin composition

Abstract

The present invention provides an epoxy resin composition comprising epoxy resin, phenolic resin, a cure accelerator and an inorganic filler; said epoxy resin comprises: (1) 20-50% of Formula I; (2) 10-40% of Formula II; and (3) 0-30% of Formula III and/or 0-40% of Formula IV, wherein Formula III and Formula IV are not 0% simultaneously; and wherein, R 1 and R 2 are independently hydrogen or alkyl of C 1 -C 6 ; n is an integer from 0 to 50 in Formula I; the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8-1.3; all said percentages are percentages relative to the total mass of the epoxy resin mixture. The present invention provides a green, environmentally friendly epoxy resin composition with high reliability and low warpage properties that can satisfy the requirement of lead-free high temperature reflux process.

1 . An epoxy resin composition comprising epoxy resin, phenolic resin, cure accelerator and inorganic filler, said epoxy resin comprising:
 (1) 20-50% of Formula I;   (2) 10-40% of Formula II; and   (3) 0-30% of Formula III and/or 0-40% of Formula IV, wherein Formula III and Formula IV are not 0% simultaneously;   
       
         
           
           
               
               
           
         
       
       wherein, R 1  and R 2  are independently hydrogen or C 1 -C 6  alkyl; n is an integer from 0 to 50 in Formula I; the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8-1.3; all of said percentages are percentages relative to the total mass of the epoxy resin mixture. 
     
     
         2 . The epoxy resin composition of  claim 1 , characterized in that said R 1  is methyl, said R 2  is tert-butyl. 
     
     
         3 . The epoxy resin composition of  claim 1 , characterized in that the content of Formula I is 30-40%; the content of Formula II is 15-25% wherein all percentages of said content are percentages relative to the total mass of the epoxy resin mixture. 
     
     
         4 . The epoxy resin composition of  claim 1 , characterized in that the content of Formula III is 15-25% wherein all percentages of said content are percentages relative to the total mass of the epoxy resin mixture. 
     
     
         5 . The epoxy resin composition of  claim 1 , characterized in that the content of Formula IV is 20-30% wherein all percentages of said content are percentages relative to the total mass of the epoxy resin mixture. 
     
     
         6 . The epoxy resin composition of  claim 1 , characterized in that the content of said epoxy resin is 3-8% of the epoxy resin composition by mass. 
     
     
         7 . The epoxy resin composition of  claim 1 , characterized in that the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.9-1.1. 
     
     
         8 . The epoxy resin composition of  claim 1 , characterized in that said cure accelerator is an imidazole compound. 
     
     
         9 . The epoxy resin composition of  claim 1 , characterized in that the content of said cure accelerator is less than or equal to 1% of the epoxy resin composition by mass. 
     
     
         10 . The epoxy resin composition of  claim 1 , characterized in that said inorganic filler is a composite inorganic filler, wherein, said composite inorganic filler is silicon dioxide; the particle size distribution of said composite inorganic filler is as follows: 18-24% is less than 3 μm, 20-30% is more than or equal to 3 μm and less than 12 μm, 45-57% is more than or equal to 12 μm and less than 48 μm, 5-17% is more than or equal to 48 μm and less than 75 μm, wherein the percentage is a percentage by which the total mass of the composite inorganic filler is occupied, and wherein said composite inorganic filler has a median particle diameter of 14-20 μm, and an average particle diameter of 18-24 μm. 
     
     
         11 . The epoxy resin composition of  claim 1 , characterized in that the content of said inorganic filler is 85-89% of the epoxy resin composition by mass. 
     
     
         12 . The epoxy resin composition of  claim 1 , characterized in that said epoxy resin composition further comprises one or more of a flame retardant, releasing agent, coupling agent, colouring agent, stress absorbing agent, adhesion promoter and ion trapping agent. 
     
     
         13 . The epoxy resin composition of  claim 12 , characterized in that said flame retardant is one or more of nitrogen-containing, boron-containing and metal hydroxide flame retardants and the content of said flame retardants is less than or equal to 5% of the epoxy resin composition by mass.