Method of slimming radiation-sensitive material lines in lithographic applications

Abstract

A method and system for patterning a substrate using a radiation-sensitive material is described. The method and system include forming a layer of radiation-sensitive material on a substrate, exposing the layer of radiation-sensitive material to a pattern of radiation, and then performing a post-exposure bake following the exposing. The imaged layer of radiation-sensitive material is then positive-tone developed to remove a region having high radiation exposure to form radiation-sensitive material lines. An exposure gradient within the radiation-sensitive material lines is then removed, followed by slimming the radiation-sensitive material lines.

What is claimed is: 
     
         1 . A platform configured for patterning a substrate, comprising:
 a track system configured to coat a substrate with a layer of radiation-sensitive material;   a lithography system including a pattern exposure system configured to expose said substrate to patterned EM radiation;   an exposure gradient removal system configured to expose said substrate to an exposure gradient removal treatment; and   a transfer system configured to transfer said substrate between said track system, said pattern exposure system, and said exposure gradient removal system.   
     
     
         2 . The platform of  claim 1 , wherein said exposure gradient removal system is integrated with said pattern exposure system within said lithography system. 
     
     
         3 . The platform of  claim 2 , wherein said pattern exposure system comprises a radiation source, a mask imaging system, and a substrate holder. 
     
     
         4 . The platform of  claim 1 , wherein said exposure gradient removal system is a flood exposure system and a post-flood exposure system. 
     
     
         5 . The platform of  claim 1 , wherein said exposure gradient removal system is an acid wash and post-acid wash bake system. 
     
     
         6 . The platform of  claim 1 , wherein said exposure gradient removal system is an temperature control apparatus capable of heating said layer of radiation-sensitive material to a thermal decomposition temperature. 
     
     
         7 . The platform of  claim 1 , wherein said exposure gradient removal system is integrated within said track system. 
     
     
         8 . The platform of  claim 1 , wherein said exposure gradient removal system comprises a stand-alone module separate from said track system and said pattern exposure system, and coupled to said track system or said pattern exposure system or both.