US2013092555A1PendingUtilityA1
Removal of an island from a laser cut article
Individually held — no corporate assignee on recordPriority: Oct 12, 2011Filed: Oct 12, 2011Published: Apr 18, 2013
Est. expiryOct 12, 2031(~5.2 yrs left)· nominal 20-yr term from priority
C23F 1/26C23F 1/02A61F 2/91A61L 2400/18A61L 31/022
24
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Claims
Abstract
Methods and apparatuses for use in such methods for removing islands from laser cut articles. Methods include using a chemical etching solution to remove material in the strut-island gap. Optionally, heat and/or agitation can be applied during the etching process to increase the chemical activity of the chemical etching solution and/or to vibrate the islands out of position.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method for removing an island from a laser cut article, comprising:
providing a refractory metal workpiece having an outer surface and an inner surface; laser cutting the refractory metal workpiece substantially continuously along a laser cut line that extends from the outer surface to the inner surface to produce an article that includes a plurality of laser cuts and one or more islands remaining between the laser cuts; and chemically treating the article to remove the one or more islands therefrom so as to form an implantable device.
2 . The method of claim 1 , wherein the laser cutting is performed in a single pass.
3 . The method of claim 1 , wherein the one or more islands are affixed to the article by one or more of slag, remelt, laser ablated material, oxide-oxide bonding, or geometric constraints.
4 . The method of claim 1 , wherein the refractory metal workpiece is made from a material selected from the group consisting of tantalum, niobium, tungsten, and alloys thereof.
5 . The method of claim 1 , wherein the implantable device is an implantable refractory metal stent.
6 . The method of claim 1 , the chemically treating further comprising disposing the article in a chemical etching solution that includes hydrofluoric acid (HF) and nitric acid (HNO 3 ).
7 . The method of claim 6 , further comprising disposing the article in the chemical etching solution for a period of time in a range from about 10 minutes to about 60 minutes.
8 . The method of claim 6 , further comprising:
sonicating in the chemical etching solution using an ultrasonic cleaning apparatus while the article is disposed in the chemical etching solution; and heating the article in the chemical etching solution to a temperature in a range from about 40° C. to about 70° C. while the article is disposed in the chemical etching solution.
9 . The method of claim 1 , the chemically treating further comprising etching the article in a chemical etching solution including at least one mineral acid.
10 . The method of claim 9 , the at least one mineral acid including hydrofluoric acid (HF).
11 . The method of claim 9 , the at least one mineral acid including hydrofluoric acid (HF) and nitric acid (HNO 3 ).
12 . The method claim 11 , the chemical etching solution including about 1% HF by volume to about 10% HF by volume, about 10% HNO 3 by volume to about 50% HNO 3 by volume, and water.
13 . The method claim 11 , the chemical etching solution including about 1% HF by volume to about 5% HF by volume, about 20% HNO 3 by volume to about 45% HNO 3 by volume, and water.
14 . The method claim 11 , the chemical etching solution including about 1% HF by volume to about 3% HF by volume, about 25% HNO 3 by volume to about 35% HNO 3 by volume, and water.
15 . The method claim 11 , wherein the chemical etching solution further includes urea.
16 . The method claim 11 , the chemical etching solution including about 2% HF by volume to about 4% HF by volume, about 25% HNO 3 by volume to about 35% HNO 3 by volume, about 0.9 weight % (“wt %”) to about 1.3 wt % urea, and water.
17 . A method for removing an island from a refractory metal article, the method comprising:
providing a refractory metal workpiece having an outer surface and an inner surface; laser cutting the refractory metal workpiece substantially continuously along a laser cut line that extends from the outer surface to the inner surface in a single pass to produce a laser cut refractory metal article that includes a plurality of laser cuts and one or more islands remaining between the laser cuts; and treating the laser cut refractory metal article to remove the one or more islands therefrom, the treating comprising:
disposing the laser cut refractory metal article in a chemical etching solution that includes hydrofluoric acid (HF) and nitric acid (HNO 3 ) for a period of time sufficient to remove the one or more islands therefrom so as to form an implantable device.
18 . The method of claim 17 , the treating further comprising:
heating the laser cut refractory metal article in the chemical etching solution to a temperature in a range from about 40° C. to about 70° C.; and sonicating the laser cut refractory metal article in the chemical etching solution using an ultrasonic apparatus.
19 . The method of claim 18 , further comprising treating the laser cut refractory metal article for a period of time in a range from about 10 minutes to about 60 minutes.
20 . The method claim 17 , wherein the chemical etching solution includes about 1% HF by volume to about 10% HF by volume, about 10% HNO 3 by volume to about 50% HNO 3 by volume, and water.
21 . The method of claim 17 , wherein the refractory metal workpiece is made from a material selected from the group consisting of tantalum, niobium, tungsten, and alloys thereof.
22 . The method of claim 17 , wherein the refractory metal workpiece is made from a tantalum alloy, comprising:
about 75 to about 90 weight percent tantalum; about 8 to about 12 weight percent niobium; about 2 to about 10 weight percent tungsten.
23 . The method of claim 22 , wherein the refractory metal workpiece further comprises at least one of zirconium or molybdenum.
24 . A method for removing an island from an implantable article, the method comprising:
providing a tubular a tantalum alloy workpiece having an outer surface and an inner surface; laser cutting the tubular a tantalum alloy workpiece substantially continuously along a patterned laser cut line that extends from the outer surface to the inner surface to produce a laser cut stent that includes a patterned plurality of laser cut struts and one or more islands remaining between the laser cut struts, wherein the laser cut struts have a cross-sectional dimension of about 40 μm to about 120 μm; and treating the laser cut stent to remove the one or more islands therefrom, the treating comprising:
disposing the laser cut stent in a chemical etching solution that includes hydrofluoric acid (HF) and nitric acid (HNO 3 );
heating the laser cut stent in the chemical etching solution to a temperature in a range from about 40° C. to about 70° C.;
sonicating the laser cut stent in the chemical etching solution using an ultrasonic apparatus; and
treating the laser cut stent in the chemical etching solution under heating and sonication for a period of time sufficient to remove the one or more islands therefrom so as to form an implantable stent.
25 . The method of claim 24 , wherein the laser cutting is performed in a single pass using a picosecond laser apparatus.
26 . The method of claim 24 , wherein the tubular tantalum alloy workpiece includes tantalum and one or more of niobium, tungsten, zirconium and molybdenum.
27 . The method of claim 24 , wherein the laser cut struts of the laser cut stent have a cross-sectional dimension of about 45 μm to about 80 μm.
28 . The method of claim 24 , wherein the laser cut struts of the laser cut stent have a cross-sectional dimension of about 50 μm to about 80 μm.
29 . A method of manufacturing an implantable article, comprising
providing a first refractory metal workpiece having an outer surface and an inner surface, the first refractory metal workpiece being made from a material selected from the group consisting of tantalum, niobium, tungsten, zirconium, molybdenum, and alloys thereof; laser cutting the first refractory metal workpiece in a single pass using a picosecond laser apparatus substantially continuously along a patterned laser cut line that extends from the outer surface to the inner surface to form a laser cut stent that includes a patterned plurality of laser cut struts and one or more islands remaining between the laser cut struts, wherein the laser cut struts have a cross-sectional dimension of about 40 μm to about 120 μm; treating the laser cut stent for a period of time sufficient to remove the one or more islands therefrom, the treating comprising:
disposing the laser cut stent in a chemical etching solution that includes hydrofluoric acid (HF) and nitric acid (HNO 3 );
heating the laser cut stent in the chemical etching solution to a temperature in a range from about 40° C. to about 70° C.;
sonicating the laser cut stent in the chemical etching solution using an ultrasonic apparatus;
wherein the treating does not include use of a mask capable of defining a plurality of struts and a plurality of islands remaining between the struts;
electropolishing the laser cut metal stent in an electropolishing solution; and heat treating the laser cut refractory metal stent so as to form an implantable stent.Join the waitlist — get patent alerts
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