Heat sink and method of forming a heatsink using a wedge-lock system

Abstract

The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.

What is claimed is: 
     
         1 . A method for forming a heatsink, the method comprising:
 forming at least one thermo pyrolytic graphite (TPG) element, the at least one TPG element comprising a first side having a wedge-shaped surface and a second side having a flat surface;   layering a metal material over the at least one TPG element, the metal material configured to be complementary to the first side of the at least one TPG element; and   applying pressure to fasten the metal material to the at least one TPG element.   
     
     
         2 . A method in accordance with  claim 1 , wherein the at least one TPG element is formed as a strip. 
     
     
         3 . A method in accordance with  claim 1 , wherein a plurality of TPG elements are formed. 
     
     
         4 . A method in accordance with  claim 1 , wherein the at least one TPG element is attached to a strip retention plate, wherein the strip retention plate is attached to the second side of the TPG element. 
     
     
         5 . A method in accordance with  claim 1 , wherein the at least one TPG element is further attached to the metal material using thermally conductive adhesive. 
     
     
         6 . A method in accordance with  claim 1 , wherein the metal material being selected from the group consisting of aluminum, copper, and combinations thereof is layered over the at least one TPG element. 
     
     
         7 . A method in accordance with  claim 6 , wherein the metal material comprising a metal fin assembly is layered over the at least one TPG element. 
     
     
         8 . A method in accordance with  claim 6 , wherein the metal material comprising a conduction-cooled heatframe is layered over the at least one TPG element. 
     
     
         9 . A method in accordance with  claim 1 , further comprising layering a thermal spacer over the second side of the at least one TPG element, wherein the at least one TPG element is positioned between the thermal spacer and the metal material. 
     
     
         10 . A method in accordance with  claim 9 , wherein the thermal spacer being comprised of a material selected from the group consisting of aluminum, copper, and combinations thereof, is layered over the second side of the at least one TPG element. 
     
     
         11 . A method in accordance with  claim 1 , further comprising applying a metal-based coating material to the first side of the at least one TPG element prior to layering the metal material. 
     
     
         12 . A method in accordance with  claim 1 , further comprising applying a thermal interface material between the metal material and the at least one TPG element. 
     
     
         13 . A heatsink comprising:
 at least one thermo pyrolytic graphite (TPG) element, the at least one TPG element comprising a first side having a wedge-shaped surface and an opposing second side having a flat surface; and
 a metal material coupled to the first side of the at least one TPG element. 
   
     
     
         14 . A heatsink in accordance with  claim 13 , further comprising a strip retention plate coupled to the second side of the at least one TPG element. 
     
     
         15 . A heatsink in accordance with  claim 13 , wherein a thermal interface material is disposed between the metal material and the at least one TPG element. 
     
     
         16 . A heatsink comprising:
 at least one thermo pyrolytic graphite (TPG) element, the at least one TPG element comprising a first side having at least one hole through the at least one TPG element, wherein the at least one TPG element is configured to be complementary to at least one expandable bushing; and   a metal material coupled to an inner surface of the at least one hole in the at least one TPG element.   
     
     
         17 . A heatsink in accordance with  claim 16 , further comprising a thermal interface material disposed between the metal material, the at least one TPG element, and the at least one expandable bushing.