Ceramic radiation heat dissipation structure

Abstract

A ceramic radiation heat dissipation structure for heat dissipation from a heat source includes a ceramic substrate, a first radiation heat dissipation film and a porous heat dissipation plate. One surface of the ceramic substrate is attached to the heat source and the other surface of the ceramic substrate is provided with a first radiation heat dissipation film. The porous heat dissipation plate is attached to the first radiation heat dissipation film. The porous heat dissipation plate has at least one heat dissipation hole, and an inner sidewall of the at least one heat dissipation hole is provided with a second radiation heat dissipation film. The heat generated by the heat source is fast propagated outwards because of the high efficiency of thermal radiation provided by the first and second radiation heat dissipation films.

What is claimed is: 
     
         1 . A ceramic radiation heat dissipation structure for heat dissipation from a heat source, comprising:
 a ceramic substrate having a first surface and a second surface, wherein the first surface of the ceramic substrate is attached to the heat source;   a first radiation heat dissipation film provided on the second surface of the ceramic substrate; and   a porous heat dissipation plate attached to the first radiation heat dissipation film and having at least one heat dissipation hole, wherein a second radiation heat dissipation film is provided on an upper surface of the porous heat dissipation plate and an inner sidewall of the heat dissipation hole;   wherein, the first and second radiation heat dissipation films are made from a mixture of metal and nonmetal compound, wherein the first and second radiation heat dissipation films dissipate heat generated from the heat source outwards by thermal radiation.   
     
     
         2 . The ceramic radiation heat dissipation structure as claimed in  claim 1 , further comprising a fan disposed on an outer side of the porous heat dissipation plate. 
     
     
         3 . The ceramic radiation heat dissipation structure as claimed in  claim 1 , wherein the mixture of metal and nonmetal compound consist of at least one of silver, copper, tin, aluminum, titanium, iron and antimony, or at least one alloy of silver, copper, tin, aluminum, titanium, iron and antimony, or at least one oxide or halide of silver, copper, tin, aluminum, titanium, iron and antimony, and one oxide or nitride or inorganic acid consisting at least one of boron and carbon. 
     
     
         4 . The ceramic radiation heat dissipation structure as claimed in  claim 1 , further comprising a heat dissipation paste for mounting the heat source onto the ceramic substrate. 
     
     
         5 . A ceramic radiation heat dissipation structure for heat dissipation from a heat source, comprising:
 a ceramic substrate having a first surface and a second surface, wherein the first surface of the ceramic substrate is attached to the heat source;   a first radiation heat dissipation film provided on the second surface of the ceramic substrate; and   a multicolumn heat dissipation plate attached to the first radiation heat dissipation film and having at least one heat dissipation column, wherein a third radiation heat dissipation film is provided on an upper surface of the multicolumn heat dissipation plate or on an outer surface of the heat dissipation column,   wherein, the first and third radiation heat dissipation films are made from a mixture of metal and nonmetal compound, and wherein the first and third radiation heat dissipation films dissipate heat generated from the heat source outwards by thermal radiation.   
     
     
         6 . The ceramic radiation heat dissipation structure as claimed in  claim 5 , further comprising a fan disposed on an outer side of the porous heat dissipation plate. 
     
     
         7 . The ceramic radiation heat dissipation structure as claimed in  claim 5 , wherein the mixture of metal and nonmetal compound consist of at least one of silver, copper, tin, aluminum, titanium, iron and antimony, or at least one alloy of silver, copper, tin, aluminum, titanium, iron and antimony, or at least one oxide or halide of silver, copper, tin, aluminum, titanium, iron and antimony, and one oxide or nitride or inorganic acid consisting at least one of boron and carbon. 
     
     
         8 . The ceramic radiation heat dissipation structure as claimed in  claim 5 , further comprising a heat dissipation paste for mounting the heat source onto the ceramic substrate.