Film Conductor for Flat Cells and Method for Producing Same

Abstract

A foil conductor for flat cells includes a contact zone for contact with further cells or busbars, an adhesion zone for adhesive bonding with a packaging foil of a cell, and a connection zone for connection to an electrode foil within the cell. At least two of the zones have a surface composition differing from each other.

1 - 21 . (canceled) 
     
     
         22 . A foil conductor for flat cells, comprising:
 a contact zone configured for contact with further cells or busbars;   an adhesion zone configured for adhesive bonding with a packaging foil of a cell; and   a connection zone configured for connection to an electrode foil within the cell,   wherein at least two of the zones have a surface composition that are different from each other.   
     
     
         23 . The foil conductor according to  claim 22 , wherein the foil conductor comprises an aluminium base structure and the adhesion zone comprises an adhesion base/conversion layer. 
     
     
         24 . The foil conductor according to  claim 23 , wherein there is no natural aluminium oxide skin between the adhesion base/conversion layer of the adhesion zone and the aluminum base structure. 
     
     
         25 . The foil conductor according to  claim 23 , wherein a polymer layer is arranged on the adhesion base/conversion layer of the adhesion zone. 
     
     
         26 . The foil conductor according to  claim 22 , wherein the foil conductor comprises an aluminium base structure and the contact zone comprises a solderable coating. 
     
     
         27 . The foil conductor according to  claim 26 , wherein the solderable coating contains nickel, tin, copper or silver. 
     
     
         28 . The foil conductor according to  claim 22 , wherein the foil conductor comprises a copper base structure. 
     
     
         29 . The foil conductor according to  claim 28 , wherein the adhesion zone has a roughened surface. 
     
     
         30 . The foil conductor according to  claim 28 , wherein the foil conductor comprises a nickel-plated surface. 
     
     
         31 . The foil conductor according to  claim 22 , wherein the surface or coating structure of the contact zone is conditioned for a soldering or welding process. 
     
     
         32 . The foil conductor according to  claim 22 , wherein a surface or coating structure of the connecting zone is conditioned for an ultrasonic welding process. 
     
     
         33 . The foil conductor according to  claim 22 , wherein the foil conductor has a rectangular cross-section with short sides of the rectangles extending outwardly in a manner of a wedge or tongue. 
     
     
         34 . A method for producing a foil conductor for flat cells, comprising:
 forming a contact zone configured for contact with further cells or busbars;   forming an adhesion zone configured for adhesive bonding with a packaging foil of a cell; and   forming a connection zone configured for connection to an electrode foil within the cell,   wherein at least two zones have a surface composition different from each other are produced on a flat metal base structure.   
     
     
         35 . The method for producing a foil conductor for flat cells according to  claim 34 , wherein a surface of the connection zone is conditioned for an ultrasonic welding process. 
     
     
         36 . The method for producing a foil conductor for flat cells according to  claim 35 , wherein the surface of the connection zone is conditioned for the surface structure or the coating of the contact zone for a soldering or welding process. 
     
     
         37 . The method according to  claim 34 , further comprising:
 punching out from aluminum strip material,   degreasing; and   removing a natural oxide skin.   
     
     
         38 . The method according to  claim 34 , further comprising:
 coating of the adhesion zone with an adhesion base/conversion layer.   
     
     
         39 . The method according to  claim 38 , further comprising:
 pre-sealing of the adhesion zone.   
     
     
         40 . The method according to  claim 34 , further comprising:
 etching of the contact zone.   
     
     
         41 . The method according to  claim 40 , further comprising:
 metallization of the contact zone with a solderable surface.   
     
     
         42 . The method according to  claim 34 , further comprising:
 a stamping stage.