Heat sink apparatus for exothermic element

Abstract

A heat sink apparatus for an exothermic element includes a first copper heat plate for accumulating heat of an exothermic element, a copper heat path for conducting the accumulated heat in an extended direction of the copper heat path, a second copper heat plate for dispersing the conducted heat, and a heat fin for discharging the accumulated or discharged heat to the outside.

1 . A heat sink apparatus for an exothermic element, comprising:
 a first copper heat plate for accumulating heat of an exothermic element, wherein one surface of the first copper heat plate being in close contact with the exothermic element;   a copper heat path for conducting the accumulated heat in an extended direction of the copper heat path, wherein the copper heat path extending from the other surface of the first copper heat plate;   a second copper heat plate for dispersing the conducted heat, wherein one surface of the second copper heat plate being spaced apart from the other surface of the first copper heat plate and the second copper heat plate including a supporting hole, wherein the supporting hole being in close contact with and supporting the copper heat path; and   a heat fin for discharging the accumulated or discharged heat to the outside, wherein the heat fin being formed at the other surface of the first copper heat plate and the other surface of the second copper heat plate.   
     
     
         2 . The heat sink apparatus for the exothermic element according to  claim 1 , further comprising:
 a third copper heat plate partially or entirely seals side surfaces of the first copper heat plate, the second copper heat plate, and the heat fin.   
     
     
         3 . The heat sink apparatus for the exothermic element according to  claim 1 , further comprising:
 at least one copper heat coil,   wherein one end of the copper heat coil is connected to the extended end of the copper heat path or the other surface of the second copper heat plate,   the copper heat coil is wound from the one end to the other end without contacting, and   the copper heat coil conducts the accumulated or discharged heat to the other end, vibrates by a temperature difference with the atmosphere, and discharges the heat to the outside by forced convection.   
     
     
         4 . The heat sink apparatus for the exothermic element according to  claim 3 , wherein the copper heat coil has a wound coil shape or a wound plate shape. 
     
     
         5 . The heat sink apparatus for the exothermic element according to  claim 1 , further comprising:
 a fourth copper heat plate extended from the first copper heat plate to form side surfaces and an upper surface, wherein the fourth copper heat plate makes an airtight inner space where a coolant is positioned; and   a copper heat fin formed at an outer surface of the copper heat path being in contact with the coolant and conducting the conducted heat from the copper heat path to the coolant.   
     
     
         6 . The heat sink apparatus for the exothermic element according to  claim 5 , wherein the coolant is antifreeze. 
     
     
         7 . The heat sink apparatus for the exothermic element according to  claim 5 , wherein the copper heat path has a pipe shape having at least a pair of ends connected to each other and being filled with the coolant. 
     
     
         8 . The heat sink apparatus for the exothermic element according to  claim 1 , further comprising:
 a low-speed cooling fan installed at one side of a heat block the first copper heat plate, the copper heat path, the second copper heat plate, and the heat fin, wherein the low-speed cooling fan forced-convecting the atmosphere and eliminating dust of the heat block during an operation having an operation time of 25,000 hours or more; and   a thermostat detecting temperature of the heat block, wherein the thermostat welting the low-speed cooling fan when the temperature is the predetermined threshold temperature or more and stopping the low-speed cooling fan when the temperature is less than the predetermined threshold temperature.   
     
     
         9 . The heat sink apparatus for the exothermic element according to  claim 1 , wherein the copper heat path has one of a pipe shape, a plate shape, a polygonal stick shape, or a coil shape. 
     
     
         10 . The heat sink apparatus for the exothermic element according to  claim 1 , wherein the second copper heat plate comprises at least two second copper heat plates spaced apart from each other in the extended direction of the copper heat path, and
 the heat fin comprises at least two heat fins formed at the at least two second copper heat plates, respectively.   
     
     
         11 . The heat sink apparatus for the exothermic element according to  claim 1 , wherein the heat fin comprises an aluminum material and a mixture material of aluminum and copper. 
     
     
         12 . The heat sink apparatus for the exothermic element according to  claim 1 , wherein the heat fin comprises a plate-shape fin or a corrugated fin. 
     
     
         13 . The heat sink apparatus for the exothermic element according to  claim 1 , further comprising:
 an aluminum case supporting the first copper heat plate, the copper heat path, the second copper heat plate, and the heat fin,   wherein the aluminum case has an open type or a close type.   
     
     
         14 . The heat sink apparatus for the exothermic element according to  claim 1 , wherein the exothermic element is at least one of a light emitting diode (LED) device or an exothermic element for information technology (IT). 
     
     
         15 . The heat sink apparatus for the exothermic element according to  claim 14 , further comprising:
 an aluminum LED cover fixing and supporting the LED device, and   a synthetic-resin LED cover surrounding the LED device to an outermost cover and protecting the LED device.   
     
     
         16 . A heat sink apparatus for an exothermic element, comprising:
 a first heat plate for accumulating heat of an exothermic element, wherein one surface of the first heat plate being in close contact with the exothermic element, wherein the first heat plate comprising a first metal material;   a heat path for conducting the accumulated heat in an extended direction of the heat path, wherein the heat path extending from the other surface of the first heat plate, wherein the heat path comprising the first metal material;   a second heat plate for dispersing the conducted heat, wherein one surface of the second heat plate being spaced apart from the other surface of the first heat plate and the second heat plate including a supporting hole, wherein the supporting hole being in close contact with and supporting the heat path, wherein the second heat plate comprising the first metal material; and   a heat fin for discharging the accumulated or discharged heat to the outside, wherein the heat fin being formed at the other surface of the first heat plate and the other surface of the second heat plate, wherein the heat fin comprising a second metal material having heat-radiating efficiency higher than that of the first metal material.   
     
     
         17 . The heat sink apparatus for the exothermic element according to  claim 16 , wherein the second metal material comprises an aluminum material and a mixture material of aluminum and copper, and
 the first metal material comprises gold, silver, or copper having thermal conductivity and heat-accumulating property superior than those of the second metal material.