US2013068008A1PendingUtilityA1
High temperature piezoresistive strain gauges made of silicon-on-insulator
Est. expiryMar 17, 2031(~4.6 yrs left)· nominal 20-yr term from priority
G01L 1/26E21B 47/017G01L 1/18E21B 47/01
30
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Claims
Abstract
Disclosed is an apparatus for measuring a parameter in a borehole penetrating the earth. The apparatus includes a sensor configured to be disposed in the borehole and having a piezo-resistor fabricated from a semiconductor on an insulator wherein a portion of the semiconductor is etched to the insulator to form the piezo-resistor, the piezo-resistor being responsive to the parameter.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An apparatus for measuring a parameter in a borehole penetrating the earth, the apparatus comprising:
a sensor configured to be disposed in the borehole and having a piezo-resistor fabricated from a semiconductor on an insulator wherein a portion of the semiconductor is etched to the insulator to form the piezo-resistor, the piezo-resistor being responsive to the parameter.
2 . The apparatus according to claim 1 , wherein the piezo-resistor comprises a plurality of piezo-resistors.
3 . The apparatus according to claim 2 , wherein the plurality of piezo-resistors comprises a network.
4 . The apparatus according to claim 3 , wherein the network comprises an electrical bridge.
5 . The apparatus according to claim 4 , wherein the electrical bridge comprises a Wheatstone bridge.
6 . The apparatus according to claim 1 , wherein the semiconductor is doped with n-type or p-type doping material up to a degeneration region of the semiconductor.
7 . The apparatus according to claim 1 , wherein the semiconductor comprises silicon and the insulator comprises silicon dioxide.
8 . The apparatus according to claim 1 , further comprising an electrical signal source coupled to the piezo-resistor to energize the piezo-resistor.
9 . The apparatus according to claim 1 , further comprising an amplifier coupled to the piezo-resistor and configured to amplify an output signal corresponding to the measured parameter.
10 . The apparatus according to claim 1 , wherein the parameter is at least one of acceleration, force, tilt, contact, pressure, strain, stress, and magnetic field fluctuations.
11 . The apparatus according to claim 10 , wherein the sensor is configured as a Hall sensor.
12 . The apparatus according to claim 10 , wherein the parameter is related to a property of an earth formation penetrated by the borehole.
13 . The apparatus according to claim 1 , wherein the semiconductor is on a first insulator separated from a second insulator.
14 . An apparatus for measuring a parameter in a borehole penetrating the earth, the apparatus comprising:
a carrier configured to be conveyed through the borehole; and a sensor disposed at the carrier and having a piezo-resistor fabricated from a semiconductor on an insulator wherein a portion of the semiconductor is etched to the insulator to form the piezo-resistor, the piezo-resistor being responsive to the downhole parameter.
15 . The apparatus according to claim 14 , wherein the carrier is a drill string.
16 . A method for measuring a parameter in a borehole penetrating the earth, the method comprising:
disposing a sensor into the borehole, the sensor having a piezo-resistor fabricated from a semiconductor on an insulator wherein a portion of the semiconductor is etched to the insulator to form the piezo-resistor, the piezo-resistor being responsive to the parameter; and measuring the parameter using the sensor.
17 . The method according to claim 16 , further comprising energizing the piezo-resistor with an input electrical signal.
18 . The method according to claim 17 , further comprising receiving an output electrical signal due to the energizing wherein the output electrical signal relates to the measured parameter.
19 . The method according to claim 16 , further comprising at least one of recording the measured parameter, transmitting the measured parameter to downhole electronics, or transmitting the measured parameter to a processing system disposed at the surface of the earth.
20 . The method according to claim 15 , wherein the parameter is at least one of acceleration, force, tilt, contact, pressure, strain, stress, and magnetic field fluctuations.
21 . The method according to claim 19 , wherein the parameter is related to a property of an earth formation penetrated by the borehole.
22 . The method according to claim 16 , wherein the semiconductor is on a first insulator separated from a second insulator.Join the waitlist — get patent alerts
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